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NVMFD5852NLT1G

Onsemi

NVMFD5852NLT1G by Onsemi

NVMFD5852NLT1G by Onsemi is a Power FET with N-CHANNEL polarity, 40V DS breakdown voltage, and 329A max pulsed drain current. Ideal for applications requiring high power dissipation in small outline packages like automotive electronics due to its 175 °C max operating temp and AEC-Q101 reference standard compliance.

Median Price

$1.230

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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DigiKey

USA . 4,500 parts In-Stock

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Chip Stock

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Digiode

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AZTECH Wire

Italy . 765 parts In-Stock

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TANS Electronics

Latvia . 5,976 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

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SupplyDigital Components

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UHIMA Technologies

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Microchip USA

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Corohmni

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Overview

Experience the power of innovation with the NVMFD5852NLT1G by Onsemi. As a leading manufacturer in the industry, Onsemi's Power Field Effect Transistors (FET) are designed for reliability and efficiency. This N-CHANNEL transistor boasts a range of applications, from automotive to industrial electronics. With its high-quality construction and advanced technology, the NVMFD5852NLT1G offers customers unparalleled performance and value. Trust Onsemi to deliver cutting-edge solutions for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the FET, ensuring reliability and longevity.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON resistance and higher switching speeds compared to P-Channel FETs, making them suitable for high-performance applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having separate elements with a built-in diode allows for more versatile circuit configurations and improved efficiency in certain circuit designs.

Surface Mount: YES

Surface mount technology makes it easier to assemble and miniaturize electronic devices, making this FET suitable for compact designs.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, making it suitable for various applications including power electronics.

Maximum Pulsed Drain Current (IDM): 329 A

The high pulsed drain current rating allows this FET to handle high current spikes, making it suitable for applications with demanding power requirements.

Maximum Power Dissipation (Abs): 27 W

With a high power dissipation rating, this FET can handle significant power loads without overheating, ensuring reliability in demanding applications.

Maximum Operating Temperature: 175 °C

The high operating temperature rating allows this FET to be used in harsh environmental conditions without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) NVMFD5852NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

44 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

329 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFD5852NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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