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NVD5407NT4G

Onsemi

NVD5407NT4G by Onsemi

NVD5407NT4G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 75A IDM, and 0.026 ohm RDS(on). Ideal for applications requiring high power dissipation in small outline packages. Suitable for enhancement mode operation in various electronic devices.

Median Price

$1.570

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

$0.230

100+ parts

$0.230

1k+ parts

$0.220

10k+ parts

-

2,500

$0.230

$0.230

$0.220

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Chip1Stop

Japan . 2,459 parts In-Stock

1+ parts

$2.910

100+ parts

$0.967

1k+ parts

$0.628

10k+ parts

-

2,459

$2.910

$0.967

$0.628

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,652 parts In-Stock

1+ parts

$0.218

100+ parts

-

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1,652

$0.218

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Flip Electronics

USA . 8,000 parts In-Stock

1+ parts

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8,000

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Vyrian

USA . 5,608 parts In-Stock

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5,608

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Distributors (Availability)

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Corphita

USA . 2,169 parts In-Stock

1+ parts

$0.207

100+ parts

-

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10k+ parts

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2,169

$0.207

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-

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Corohmni

South Africa . 363 parts In-Stock

1+ parts

$0.230

100+ parts

-

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363

$0.230

-

-

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AZTECH Wire

Italy . 164 parts In-Stock

1+ parts

$12.770

100+ parts

-

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164

$12.770

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Perfect Parts

USA . 27,873 parts In-Stock

1+ parts

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27,873

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QUARKTWIN TECHNOLOGY LTD

USA . 24,257 parts In-Stock

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24,257

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SupplyDigital Components

Austria . 8,306 parts In-Stock

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8,306

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TANS Electronics

Latvia . 7,367 parts In-Stock

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7,367

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Problanco Electronics

Mexico . 3,393 parts In-Stock

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3,393

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Authorized Procurement Solutions

USA . 2,459 parts In-Stock

1+ parts

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2,459

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GreenTree Electronics

Israel . 2,459 parts In-Stock

1+ parts

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2,459

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Kulean Microsystems

USA . 1,107 parts In-Stock

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1,107

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UHIMA Technologies

Türkiye . 227 parts In-Stock

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227

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Overview

Discover the unparalleled performance and reliability of the NVD5407NT4G by Onsemi, a leading manufacturer in the field of Power Field Effect Transistors (FET). With its N-CHANNEL configuration, built-in diode, and high-quality construction using metal-oxide semiconductor technology, this transistor offers exceptional efficiency and durability for a wide range of applications. From power supplies to motor control systems, the NVD5407NT4G delivers outstanding results, making it the ideal choice for customers seeking top-notch performance and value in their electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection for the FET, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer lower on-resistance and higher electron mobility compared to P-channel FETs, making them efficient for power management.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide high input impedance and can be easily controlled with a small voltage, making them ideal for switching applications.

Maximum Power Dissipation (Abs): 75 W

With a high power dissipation rating, this FET can handle large amounts of power without overheating, ensuring reliable performance in demanding environments.

Avalanche Energy Rating (EAS): 150 mJ

The high avalanche energy rating makes this FET suitable for applications where high energy transient pulses are common, providing robust protection against voltage spikes.

Technical Specifications

Power Field Effect Transistors (FET) NVD5407NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

150 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

38 A

Maximum Drain Current (ID):

38 A

Maximum Drain-Source On Resistance:

.026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

80 pF

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

75 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVD5407NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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