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NTTFS5826NLTWG

Onsemi

NTTFS5826NLTWG by Onsemi

NTTFS5826NLTWG by Onsemi is a Power FET with 60V DS Breakdown Voltage, 133A IDM, and 0.032 ohm RDS(on). It is an N-CHANNEL transistor for SWITCHING applications. This MOSFET operates in ENHANCEMENT MODE and has a max temp of 175 °C suitable for various electronic devices.

Median Price

$0.330

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13 parts In-Stock

1+ parts

-

100+ parts

$0.330

1k+ parts

$0.274

10k+ parts

$0.244

13

-

$0.330

$0.274

$0.244

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,563 parts In-Stock

1+ parts

$0.257

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-

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1,563

$0.257

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Vyrian

USA . 8,889 parts In-Stock

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8,889

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Distributors (Availability)

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Corphita

USA . 2,291 parts In-Stock

1+ parts

$0.244

100+ parts

-

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2,291

$0.244

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Corohmni

South Africa . 67 parts In-Stock

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$0.271

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67

$0.271

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AZTECH Wire

Italy . 589 parts In-Stock

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$20.030

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589

$20.030

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Kepictronics

USA . 65,590 parts In-Stock

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65,590

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RC Electronics

USA . 65,286 parts In-Stock

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65,286

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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QUARKTWIN TECHNOLOGY LTD

USA . 7,223 parts In-Stock

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Kulean Microsystems

USA . 5,726 parts In-Stock

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5,726

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TANS Electronics

Latvia . 5,221 parts In-Stock

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Perfect Parts

USA . 4,471 parts In-Stock

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4,471

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Problanco Electronics

Mexico . 1,530 parts In-Stock

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SupplyDigital Components

Austria . 542 parts In-Stock

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542

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UHIMA Technologies

Türkiye . 197 parts In-Stock

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Overview

Unleash the power of innovation with the NTTFS5826NLTWG by Onsemi. Crafted with precision and expertise, this Power FET offers unrivaled quality and reliability for a wide range of switching applications. With its N-channel configuration and built-in diode, this transistor delivers seamless performance and efficiency. From its small outline package to its high operating temperature, this product is designed to exceed expectations. Elevate your projects with the cutting-edge technology of Onsemi and experience the difference in performance and value that the NTTFS5826NLTWG brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction makes the transistor lightweight and durable, ideal for applications where weight and reliability are important factors.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors typically have lower on-state resistance and higher switching speeds compared to P-CHANNEL types, making them efficient for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides reverse polarity protection and simplifies design, making it a convenient choice for many circuit applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast response times and high efficiency in switching operations.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, reducing manufacturing costs and saving space on the board.

Minimum DS Breakdown Voltage: 60 V

The 60V breakdown voltage ensures reliable operation in various voltage conditions, making it suitable for a wide range of power applications.

Maximum Pulsed Drain Current (IDM): 133 A

With a high pulsed drain current rating, this transistor can handle peak power loads effectively, providing robust performance in demanding situations.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the transistor to function in harsh environmental conditions, increasing its versatility for a variety of applications.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS5826NLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

20 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

133 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS5826NLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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