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NTTFS5811NLTAG

Onsemi

NTTFS5811NLTAG by Onsemi

NTTFS5811NLTAG by Onsemi is a Power FET with N-CHANNEL polarity, 40V DS Breakdown Voltage, and 211A Max Pulsed Drain Current. It is used in applications requiring high power dissipation, such as automotive electronics and industrial control systems.

Median Price

$0.302

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,500 parts In-Stock

1+ parts

$0.293

100+ parts

$0.276

1k+ parts

$0.249

10k+ parts

-

16,500

$0.293

$0.276

$0.249

-

Verical

USA . 16,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.312

16,500

-

-

-

$0.312

Distributors (In-Stock)

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Digiode

USA . 512 parts In-Stock

1+ parts

$0.278

100+ parts

-

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-

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512

$0.278

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Flip Electronics

USA . 16,500 parts In-Stock

1+ parts

-

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16,500

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Vyrian

USA . 5,810 parts In-Stock

1+ parts

-

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5,810

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 588 parts In-Stock

1+ parts

$0.264

100+ parts

-

1k+ parts

-

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588

$0.264

-

-

-

AZTECH Wire

Italy . 470 parts In-Stock

1+ parts

$21.530

100+ parts

-

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470

$21.530

-

-

-

Component Stockers USA

USA . 479 parts In-Stock

1+ parts

$99.990

100+ parts

-

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479

$99.990

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 14,659 parts In-Stock

1+ parts

-

100+ parts

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14,659

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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SupplyDigital Components

Austria . 6,762 parts In-Stock

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6,762

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Kulean Microsystems

USA . 5,419 parts In-Stock

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5,419

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Perfect Parts

USA . 5,040 parts In-Stock

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5,040

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TANS Electronics

Latvia . 4,427 parts In-Stock

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4,427

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Problanco Electronics

Mexico . 1,416 parts In-Stock

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1,416

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UHIMA Technologies

Türkiye . 937 parts In-Stock

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937

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Corohmni

South Africa . 219 parts In-Stock

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219

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Kepictronics

USA . 95 parts In-Stock

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95

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Overview

Experience the power of innovation with the NTTFS5811NLTAG by Onsemi. As a leader in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are designed to exceed expectations. This N-CHANNEL transistor with a built-in diode offers unmatched reliability and performance for a wide range of applications. Whether you're working on automotive, industrial, or consumer electronics projects, this transistor's enhanced mode operation and high energy rating make it a valuable investment. Trust Onsemi to provide cutting-edge technology that empowers your designs to reach new heights of efficiency and effectiveness. Choose the NTTFS5811NLTAG and elevate your creations today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the FET, ensuring it can handle various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and lower on-resistance compared to P-channel FETs, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse current flow, adding convenience and reliability to the product.

Surface Mount: YES

Surface mount technology simplifies the manufacturing process and allows for higher component density on PCBs, making the FET ideal for compact and space-constrained applications.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage ensures the FET can handle high voltage applications without the risk of damage or failure.

Maximum Pulsed Drain Current (IDM): 211 A

The high pulsed drain current rating allows the FET to handle sudden current spikes or surges, making it suitable for power amplification and switching applications.

Maximum Drain Current (Abs) (ID): 53 A

The high maximum drain current rating allows for continuous high-power operation, making the FET reliable in demanding applications.

Maximum Power Dissipation (Abs): 33 W

The high power dissipation rating ensures the FET can handle high power levels without overheating, improving overall performance and reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency, fast switching speeds, and low gate capacitance, making the FET suitable for high-frequency applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the FET to operate in harsh environments with elevated temperatures, ensuring reliability and longevity.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS5811NLTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

65 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

53 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

211 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NTTFS5811NLTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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