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NTTFS4943NTWG

Onsemi

NTTFS4943NTWG by Onsemi

NTTFS4943NTWG by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 8A ID, and 0.011 ohm RDS(ON). It is used for SWITCHING applications in ENHANCEMENT MODE. This SMALL OUTLINE transistor features METAL-OXIDE SEMICONDUCTOR tech and SILICON material.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,808 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 90 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,052 parts In-Stock

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Problanco Electronics

Mexico . 7,606 parts In-Stock

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SupplyDigital Components

Austria . 7,007 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 1,001 parts In-Stock

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Kulean Microsystems

USA . 167 parts In-Stock

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UHIMA Technologies

Türkiye . 140 parts In-Stock

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Corohmni

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Overview

Discover the innovative NTTFS4943NTWG by Onsemi, a high-quality N-CHANNEL Small Signal Field Effect Transistor with a built-in diode. Ideal for switching applications, this transistor offers unparalleled performance and reliability. With a maximum drain current of 8A and a low on-resistance of 0.011 ohm, this product ensures efficient operation in various electronic devices. Trust in Onsemi's expertise in semiconductor technology to deliver cutting-edge solutions for your design needs. Elevate your projects with the NTTFS4943NTWG and experience the difference in quality and performance.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors typically have better conductivity and higher electron mobility, making them ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against reverse current flow, making this transistor suitable for applications where backflow of current may occur.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can handle rapid changes in voltage and current, making it ideal for use in digital circuits.

Minimum DS Breakdown Voltage: 30 V

With a breakdown voltage of 30V, this transistor can safely handle voltage spikes and fluctuations without risking damage to the device.

Package Shape: SQUARE

The square package shape provides a compact design, making it easier to mount and install in tight spaces or on circuit boards with limited real estate.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process and reduces the risk of soldering errors during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors can be easily turned on and off, providing precise control over the flow of current in the circuit.

No. of Terminals: 5

Having 5 terminals allows for more complex circuit designs and connections, enabling greater flexibility in circuit configurations.

Package Style: SMALL OUTLINE

The small outline package style reduces the overall size of the transistor, making it suitable for applications where space is limited.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making this transistor energy-efficient and reliable.

Transistor Element Material: SILICON

Silicon transistors are known for their high thermal conductivity and durability, ensuring stable performance even under harsh operating conditions.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection and long-term performance.

Maximum Drain Current (ID): 8 A

With a maximum drain current of 8A, this transistor can handle high power loads and currents, making it suitable for high-performance applications.

Maximum Drain-Source On Resistance: 0.011 ohm

Low drain-source on resistance ensures minimal power loss and heat generation, making this transistor highly efficient in transferring current from drain to source.

Terminal Position: DUAL

Having dual terminal positions allows for versatile mounting and connection options, enabling easy integration into different circuit layouts and configurations.

Case Connection: DRAIN

The drain case connection simplifies circuit design and contributes to a more efficient current flow, enhancing the overall performance of the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTTFS4943NTWG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.011 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS4943NTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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