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NTTFS4937NTAG

Onsemi

NTTFS4937NTAG by Onsemi

NTTFS4937NTAG by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 75A ID, and 0.007 ohm RDS. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at up to 150 °C. This SQUARE package with NO LEAD terminals features a BUILT-IN DIODE and DUAL terminal position.

Median Price

$15.641

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 20 parts In-Stock

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$30.740

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$30.740

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Rochester

USA . 16,500 parts In-Stock

1+ parts

-

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$0.542

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$0.450

10k+ parts

$0.401

16,500

-

$0.542

$0.450

$0.401

Distributors (In-Stock)

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Digiode

USA . 568 parts In-Stock

1+ parts

$0.422

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568

$0.422

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Flip Electronics

USA . 30,000 parts In-Stock

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Chip Stock

USA . 18,000 parts In-Stock

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Vyrian

USA . 8,794 parts In-Stock

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Corohmni

South Africa . 390 parts In-Stock

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$0.251

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$0.251

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Corphita

USA . 251 parts In-Stock

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$0.400

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251

$0.400

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AZTECH Wire

Italy . 1,022 parts In-Stock

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$17.520

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$17.520

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RC Electronics

USA . 98,716 parts In-Stock

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SupplyDigital Components

Austria . 6,938 parts In-Stock

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Problanco Electronics

Mexico . 4,530 parts In-Stock

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Futuretech Components

Singapore . 4,480 parts In-Stock

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Kepictronics

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Kulean Microsystems

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TANS Electronics

Latvia . 1,171 parts In-Stock

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UHIMA Technologies

Türkiye . 420 parts In-Stock

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Perfect Parts

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GreenTree Electronics

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Authorized Procurement Solutions

USA . 20 parts In-Stock

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Overview

Unleash the power of innovation with the NTTFS4937NTAG by Onsemi. Crafted with precision and quality, this small signal FET offers unparalleled performance in switching applications. With a maximum drain current of 75A and a minimum DS breakdown voltage of 30V, this transistor is designed to meet your every need. Whether you're looking to streamline your electronics or push the boundaries of technology, the NTTFS4937NTAG has got you covered. Elevate your projects with this cutting-edge FET and experience the difference that Onsemi's expertise brings to the table.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors are commonly used for high power applications and offer low on-state resistance, making them suitable for switching circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse current flow, adding an extra level of security to the circuit.

Transistor Application: SWITCHING

This transistor is specifically designed for switching applications, ensuring efficient and reliable performance.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage allows for the transistor to withstand voltage spikes or fluctuations without getting damaged.

Maximum Drain Current (ID): 75 A

With a high maximum drain current, this transistor can handle high current loads, making it suitable for demanding applications.

Maximum Power Dissipation: 43.1 W

The high power dissipation rating ensures the transistor can handle power fluctuations without overheating, increasing its reliability.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows for the transistor to be used in various environments without sacrificing performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTTFS4937NTAG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS4937NTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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