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NTTFS4821NTWG

Onsemi

NTTFS4821NTWG by Onsemi

NTTFS4821NTWG by Onsemi is a Power FET with 30V DS Breakdown Voltage, 171A IDM, and 0.0108 ohm RDS(on). It is an N-CHANNEL transistor for SWITCHING applications in a SQUARE package with 5 terminals. Operating in ENHANCEMENT MODE, it has a max power dissipation of 38.5W and can handle up to 150 °C temperature.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,330 parts In-Stock

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Digiode

USA . 1,401 parts In-Stock

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AZTECH Wire

Italy . 240 parts In-Stock

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$15.070

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Kulean Microsystems

USA . 7,361 parts In-Stock

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SupplyDigital Components

Austria . 7,302 parts In-Stock

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Problanco Electronics

Mexico . 7,011 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,616 parts In-Stock

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TANS Electronics

Latvia . 2,448 parts In-Stock

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Kepictronics

USA . 1,718 parts In-Stock

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Corphita

USA . 1,665 parts In-Stock

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UHIMA Technologies

Türkiye . 895 parts In-Stock

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Corohmni

South Africa . 471 parts In-Stock

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Overview

Experience the power of efficiency with the NTTFS4821NTWG by Onsemi. Crafted with precision by a leading manufacturer in the industry, this Power Field Effect Transistor offers unmatched quality and reliability. Ideal for switching applications, this N-channel transistor features a built-in diode for seamless performance. With a maximum operating temperature of 150 °C and a low drain-source on resistance, this transistor ensures optimal functionality even in demanding conditions. Upgrade your electronic designs with the NTTFS4821NTWG and enjoy enhanced performance and value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the FET, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency, making them ideal for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse currents, enhancing the overall performance of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and high efficiency, making it suitable for various power management tasks.

Surface Mount: YES

The surface mount capability makes installation easier and takes up less space on the circuit board, making it convenient for compact designs.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage allows for safe operation in applications requiring higher voltage levels, ensuring reliability and protection.

Maximum Pulsed Drain Current (IDM): 171 A

With a high pulsed drain current rating, this FET can handle short peak currents without damage, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 38.5 W

This high power dissipation rating allows the FET to handle large amounts of power without overheating, ensuring long-term reliability.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows for operation in a wide range of environments, making this FET versatile and reliable in different applications.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS4821NTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

55 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

57 A

Maximum Drain Current (ID):

13.5 A

Maximum Drain-Source On Resistance:

.0108 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

171 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS4821NTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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