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NTMFS5C646NLT3G

Onsemi

NTMFS5C646NLT3G by Onsemi

NTMFS5C646NLT3G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 93A ID, and 0.0063 ohm RDS(ON). It operates in Enhancement Mode with 750A IDM and 185mJ EAS. Ideal for power management applications due to its high power dissipation of 79W and small outline package style.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,318 parts In-Stock

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Digiode

USA . 1,699 parts In-Stock

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AZTECH Wire

Italy . 412 parts In-Stock

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Problanco Electronics

Mexico . 7,931 parts In-Stock

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SupplyDigital Components

Austria . 4,666 parts In-Stock

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TANS Electronics

Latvia . 4,593 parts In-Stock

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Microchip USA

USA . 3,280 parts In-Stock

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Kulean Microsystems

USA . 874 parts In-Stock

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UHIMA Technologies

Türkiye . 694 parts In-Stock

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Corohmni

South Africa . 499 parts In-Stock

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Corphita

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Overview

Power up your projects with the NTMFS5C646NLT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for a wide range of applications. Offering enhanced performance and reliability, this N-CHANNEL FET with a built-in diode is designed to meet your power needs efficiently. With its high DS Breakdown Voltage, low on-resistance, and excellent thermal performance, this transistor provides the value, benefits, and advantages you need for your next project. Trust Onsemi for all your power transistor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FET, ensuring a longer lifespan and reliable performance.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in power applications due to their high efficiency and low ON resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient switching operations, reducing the need for additional components.

Surface Mount: YES

Surface mount capability makes installation convenient and saves space on the PCB.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET is suitable for applications requiring robust and reliable voltage handling.

Maximum Pulsed Drain Current (IDM): 750 A

The high pulsed drain current rating allows for handling of heavy loads and high-power applications.

Maximum Power Dissipation (Abs): 79 W

The high power dissipation capability ensures the FET can handle high power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and efficiency, making it ideal for power applications.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows for use in a variety of environments and applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS5C646NLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

185 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

93 A

Maximum Drain Current (ID):

93 A

Maximum Drain-Source On Resistance:

.0063 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

750 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMFS5C646NLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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