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NTMFS4C028NT3G

Onsemi

NTMFS4C028NT3G by Onsemi

NTMFS4C028NT3G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 146A IDM, and 0.00473 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max temp of 150 °C.

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Lifecycle Status

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1k+

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Vyrian

USA . 2,774 parts In-Stock

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Digiode

USA . 1,398 parts In-Stock

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AZTECH Wire

Italy . 274 parts In-Stock

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$14.710

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QUARKTWIN TECHNOLOGY LTD

USA . 28,529 parts In-Stock

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SupplyDigital Components

Austria . 6,245 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 2,822 parts In-Stock

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Corphita

USA . 2,498 parts In-Stock

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Kulean Microsystems

USA . 2,000 parts In-Stock

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TANS Electronics

Latvia . 1,378 parts In-Stock

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Corohmni

South Africa . 176 parts In-Stock

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UHIMA Technologies

Türkiye . 160 parts In-Stock

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Overview

Discover the NTMFS4C028NT3G by Onsemi, a top-tier Power FET designed to elevate your switching applications to new heights. Crafted with precision and expertise, Onsemi delivers unrivaled quality in every aspect. From its efficient single configuration with built-in diode to its impressive 30V DS breakdown voltage, this FET is a game-changer. Experience seamless operation and enhanced performance with a maximum pulsed drain current of 146A and a minimum operating temperature of -55 °C, making it ideal for a wide range of industrial applications. Embrace innovation and reliability with the NTMFS4C028NT3G – the ultimate choice for superior power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to external elements, ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel type offers efficient switching capabilities, making it suitable for a variety of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and provides protection against reverse voltage, enhancing overall functionality.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation.

Surface Mount: YES

Surface mount feature enables easy integration onto PCBs, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages safely.

Maximum Pulsed Drain Current (IDM): 146 A

High maximum pulsed drain current allows for handling sudden surges in power, ensuring stability in demanding situations.

Maximum Power Dissipation (Abs): 25.5 W

High power dissipation capability enables the FET to withstand heat and operate continuously under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability in switching applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can handle high temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4C028NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

42 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

52 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.00473 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

146 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4C028NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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