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NTMFS4833NT3G

Onsemi

NTMFS4833NT3G by Onsemi

NTMFS4833NT3G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 288A IDM, 612.5mJ EAS, and 0.003ohm RDS(ON). With a max power dissipation of 125W and operating temperature up to 150°C, it's suitable for high-power circuits requiring efficient switching capabilities.

Median Price

$1.840

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 10 parts In-Stock

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$1.840

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$1.332

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$0.858

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10

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Component Sense

UK . 5,000 parts In-Stock

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Vyrian

USA . 4,334 parts In-Stock

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Bristol Electronics

USA . 4,039 parts In-Stock

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Digiode

USA . 766 parts In-Stock

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Prism Electronics

USA . 84 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 534 parts In-Stock

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$19.588

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534

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Semicontronic

India . 366 parts In-Stock

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$55.050

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$53.674

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$53.398

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366

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Ampacity Inc.

Singapore . 194 parts In-Stock

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$61.050

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Lixinc

USA . 11,655 parts In-Stock

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TANS Electronics

Latvia . 8,061 parts In-Stock

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Problanco Electronics

Mexico . 7,338 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

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SupplyDigital Components

Austria . 2,861 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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UHIMA Technologies

Türkiye . 670 parts In-Stock

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Aranea Global

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Corohmni

South Africa . 386 parts In-Stock

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Overview

Enhance your electronic devices with the NTMFS4833NT3G by Onsemi, a high-quality N-channel Power FET that offers exceptional performance and reliability. Manufactured by Onsemi, a leading name in the industry, this transistor is ideal for switching applications, ensuring efficient power management. With its built-in diode, small outline package style, and low on-resistance, this FET provides customers with superior value and benefits. Upgrade your designs with the NTMFS4833NT3G and experience enhanced functionality and durability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package offers good thermal conductivity and insulation properties, ensuring reliable performance in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and efficiency compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and protects the FET from reverse currents, making it more robust and reliable.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast switching speeds and low on-resistance, making it ideal for high-efficiency power conversion.

Surface Mount: YES

Surface mount package allows for easy and space-saving integration on PCBs, making it suitable for compact and densely packed designs.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle high voltage applications while providing overvoltage protection.

Package Shape: RECTANGULAR

Rectangular package shape offers easy mounting and alignment on PCBs, enhancing the ease of assembly in various electronic devices.

Terminal Form: FLAT

Flat terminals ensure secure and reliable connections, reducing the risk of intermittent or loose contacts that can affect circuit performance.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode allows for better control of the FET's conductance, enabling precise switching behavior and improved efficiency.

Maximum Pulsed Drain Current (IDM): 288 A

High pulsed drain current rating of 288A makes this FET suitable for handling short-duration high-current loads, ensuring reliability in demanding applications.

Avalanche Energy Rating (EAS): 612.5 mJ

High avalanche energy rating of 612.5mJ enables the FET to withstand transient voltage spikes and surges, enhancing overall system reliability.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4833NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

612.5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

191 A

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.003 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

288 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4833NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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