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NTMFS4833NST1G

Onsemi

NTMFS4833NST1G by Onsemi

NTMFS4833NST1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage and 156A Drain Current. It is used for SWITCHING applications, operates in ENHANCEMENT MODE, and has a max power dissipation of 86.2W. The transistor features a built-in diode, current sensor, and Kelvin sensor in an 8-terminal package suitable for surface mount technology.

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1k+

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AZTECH Wire

Italy . 322 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

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TANS Electronics

Latvia . 2,292 parts In-Stock

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Problanco Electronics

Mexico . 1,726 parts In-Stock

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Overview

Enhance your electronic projects with the NTMFS4833NST1G by Onsemi, a top-quality Small Signal Field Effect Transistor that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-CHANNEL transistor is perfect for switching applications. With built-in diode, current, and Kelvin sensor, this product provides exceptional value and benefits. Whether you're a hobbyist or a professional, this transistor's high power dissipation and operating temperature make it a must-have for any project. Upgrade your designs with the NTMFS4833NST1G and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and high performance for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND CURRENT AND KELVIN SENSOR

Includes additional features such as a diode and sensors, making it versatile and suitable for various applications.

Transistor Application: SWITCHING

Designed specifically for switching operations, providing reliable performance in these scenarios.

Minimum DS Breakdown Voltage: 30 V

Can handle high voltage levels without breakdown, ensuring long-term stability and reliability.

Package Shape: RECTANGULAR

Allows for easy installation and integration into electronic circuits.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer fast response times and precise control, making them ideal for switching applications.

Maximum Drain Current (Abs) (ID): 156 A

Capable of handling high current loads, making it suitable for demanding applications.

No. of Terminals: 8

Provides flexibility in connecting the transistor to other components or circuits.

Maximum Power Dissipation (Abs): 86.2 W

Can dissipate heat effectively, ensuring stable operation even under high power conditions.

Package Style (Meter): SMALL OUTLINE

Compact size allows for space-efficient designs and easy integration into electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high reliability and performance, making it suitable for various applications.

Maximum Operating Temperature: 150 °C

Can operate effectively even at high temperatures, ensuring consistent performance in demanding environments.

Transistor Element Material: SILICON

Silicon transistors offer excellent performance characteristics such as high gain and low noise levels.

Terminal Finish: TIN

Tin finish provides good conductivity and corrosion resistance, ensuring reliable connections.

Maximum Drain Current (ID): 16 A

Can handle high current levels, making it suitable for power applications.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options and easy connection to other components.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified time, ensuring reliability during the soldering process.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during the soldering process without affecting its performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMFS4833NST1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

156 A

Maximum Drain Current (ID):

16 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4833NST1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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