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NTHL080N120SC1

Onsemi

NTHL080N120SC1 by Onsemi

NTHL080N120SC1 by Onsemi is a Power FET with 1200V DS Breakdown Voltage, 132A IDM, and 0.11 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 178W. The transistor features an N-CHANNEL configuration in a RECTANGULAR package with METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$7.380

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 41,509 parts In-Stock

1+ parts

-

100+ parts

$6.560

1k+ parts

$5.870

10k+ parts

$5.520

41,509

-

$6.560

$5.870

$5.520

Verical

USA . 38,650 parts In-Stock

1+ parts

-

100+ parts

$8.200

1k+ parts

$7.338

10k+ parts

$6.900

38,650

-

$8.200

$7.338

$6.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,677 parts In-Stock

1+ parts

$6.944

100+ parts

-

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1,677

$6.944

-

-

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Bristol Electronics

USA . 450 parts In-Stock

1+ parts

$10.752

100+ parts

$4.659

1k+ parts

$4.408

10k+ parts

-

450

$10.752

$4.659

$4.408

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$12.959

100+ parts

-

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10

$12.959

-

-

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Ozdisan Elektronik

Türkiye . 40 parts In-Stock

1+ parts

$19.412

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-

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40

$19.412

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Vyrian

USA . 5,645 parts In-Stock

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5,645

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Chip Stock

USA . 3,240 parts In-Stock

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3,240

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ACDS - Activité Composants Distribution Service

France . 450 parts In-Stock

1+ parts

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450

-

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Dan-Mar Components

USA . 450 parts In-Stock

1+ parts

-

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450

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Cyclops Electronics Ltd

UK . 7 parts In-Stock

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7

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Distributors (Availability)

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Ampacity Inc.

Singapore . 485 parts In-Stock

1+ parts

$6.210

100+ parts

-

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485

$6.210

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Corphita

USA . 1,805 parts In-Stock

1+ parts

$6.579

100+ parts

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1,805

$6.579

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Corohmni

South Africa . 292 parts In-Stock

1+ parts

$7.310

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292

$7.310

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$12.700

100+ parts

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$12.192

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2,000

$12.700

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$12.192

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AZTECH Wire

Italy . 162 parts In-Stock

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$14.270

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162

$14.270

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Perfect Parts

USA . 58,713 parts In-Stock

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58,713

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GreenTree Electronics

Israel . 24,300 parts In-Stock

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24,300

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Lixinc

USA . 15,972 parts In-Stock

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15,972

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SupplyDigital Components

Austria . 5,710 parts In-Stock

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5,710

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Problanco Electronics

Mexico . 4,302 parts In-Stock

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4,302

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 1,864 parts In-Stock

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1,864

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Kulean Microsystems

USA . 1,290 parts In-Stock

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1,290

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UHIMA Technologies

Türkiye . 660 parts In-Stock

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660

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iodParts Technologies Inc.

India . 450 parts In-Stock

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450

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Overview

Experience the unmatched power and efficiency of the NTHL080N120SC1 by Onsemi, a top-tier manufacturer in the industry. This Power FET is a game-changer in switching applications with its N-channel configuration and built-in diode, offering unparalleled performance and reliability. Its high breakdown voltage of 1200V and low on-resistance make it ideal for a wide range of power management tasks. Trust in Onsemi's cutting-edge technology and invest in the future with the NTHL080N120SC1 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliable performance of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers efficient and fast switching capabilities.

Minimum DS Breakdown Voltage: 1200 V

With a high breakdown voltage, this FET can handle high voltage applications with ease, ensuring safety and reliability.

Maximum Pulsed Drain Current (IDM): 132 A

The high maximum pulsed drain current allows for handling of sudden peak currents, making it suitable for power applications.

Maximum Power Dissipation (Abs): 178 W

The high power dissipation capability of this FET ensures efficient operation and prevents overheating in demanding applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand high temperature environments, increasing its versatility.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology provides better performance, lower power consumption, and higher reliability compared to other technologies.

Maximum Feedback Capacitance (Crss): 6.5 pF

The low feedback capacitance helps in reducing signal loss and improving overall performance in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) NTHL080N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

171 mJ

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

31 A

Maximum Drain Current (ID):

31 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

6.5 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

132 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NTHL080N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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