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NTGD1100LT1

Onsemi

NTGD1100LT1 by Onsemi

NTGD1100LT1 by Onsemi is a Small Signal FET with N/P-Channel, used for switching applications. It features 8V DS Breakdown Voltage, 3.3A Drain Current, and 0.14ohm On Resistance. With Gull Wing terminals and a max temp of 150 °C, it's ideal for compact electronic designs requiring efficient power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 50,340 parts In-Stock

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Vyrian

USA . 5,653 parts In-Stock

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Digiode

USA . 1,109 parts In-Stock

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Ampacity Inc.

Singapore . 620 parts In-Stock

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$6.050

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AZTECH Wire

Italy . 320 parts In-Stock

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$9.860

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Component Stockers USA

USA . 565 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 5,849 parts In-Stock

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Kulean Microsystems

USA . 3,758 parts In-Stock

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Problanco Electronics

Mexico . 3,632 parts In-Stock

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SupplyDigital Components

Austria . 3,158 parts In-Stock

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TANS Electronics

Latvia . 2,756 parts In-Stock

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Corphita

USA . 1,132 parts In-Stock

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Microchip USA

USA . 462 parts In-Stock

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Corohmni

South Africa . 287 parts In-Stock

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UHIMA Technologies

Türkiye . 13 parts In-Stock

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Overview

Enhance your electronic designs with the NTGD1100LT1 by Onsemi, a top-tier manufacturer known for quality and reliability. This small signal Field Effect Transistor (FET) offers versatile applications in switching circuits, delivering unparalleled performance in a compact package. With N-Channel and P-Channel configurations, this transistor provides enhanced power efficiency and precise control. Experience the value of seamless operation and increased power dissipation with the NTGD1100LT1, designed to meet the demands of modern electronics. Elevate your projects with this high-quality component from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, ensuring its longevity and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Having both N-channel and P-channel types allows for versatility and flexibility in circuit design, catering to different requirements and applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can quickly and efficiently control the flow of current, making it ideal for use in various electronic devices and systems.

Maximum Drain Current (Abs) (ID): 3.3 A

With a high maximum drain current rating, this transistor can handle larger currents, making it suitable for applications that require higher power handling capabilities.

Maximum Power Dissipation (Abs): 0.83 W

The low power dissipation of this transistor helps in minimizing heat generation and improving overall efficiency in the circuit.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures without compromising its performance, ensuring reliability in harsh environments.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTGD1100LT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

8 V

Maximum Drain Current (Abs) (ID):

3.3 A

Maximum Drain Current (ID):

3.3 A

Maximum Drain-Source On Resistance:

.14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTGD1100LT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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