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NTD78N03R-1G

Onsemi

NTD78N03R-1G by Onsemi

NTD78N03R-1G by Onsemi is a Power FET with 25V DS Breakdown Voltage, 98A IDM, and 0.009 ohm RDS(on). Ideal for SWITCHING applications due to its N-CHANNEL configuration and ENHANCEMENT MODE operation. Package style is IN-LINE with SILICON element material and 175 °C max temp.

Median Price

$0.534

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,050 parts In-Stock

1+ parts

-

100+ parts

$0.515

1k+ parts

$0.428

10k+ parts

$0.381

4,050

-

$0.515

$0.428

$0.381

DigiKey

USA . 4,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.640

10k+ parts

-

4,050

-

-

$0.640

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Verical

USA . 3,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.534

10k+ parts

$0.476

3,300

-

-

$0.534

$0.476

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,173 parts In-Stock

1+ parts

$0.341

100+ parts

-

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1,173

$0.341

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Digiode

USA . 2,301 parts In-Stock

1+ parts

$0.401

100+ parts

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2,301

$0.401

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 319 parts In-Stock

1+ parts

$0.341

100+ parts

-

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319

$0.341

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Corphita

USA . 569 parts In-Stock

1+ parts

$0.380

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-

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569

$0.380

-

-

-

Component Stockers USA

USA . 3,642 parts In-Stock

1+ parts

$0.430

100+ parts

$0.400

1k+ parts

$0.360

10k+ parts

-

3,642

$0.430

$0.400

$0.360

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Kulean Microsystems

USA . 8,348 parts In-Stock

1+ parts

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8,348

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Problanco Electronics

Mexico . 7,141 parts In-Stock

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7,141

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SupplyDigital Components

Austria . 6,726 parts In-Stock

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6,726

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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A-Z Elektronik GmbH

Germany . 4,544 parts In-Stock

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4,544

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Continental Prestige Electronics

USA . 4,050 parts In-Stock

1+ parts

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100+ parts

$0.341

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4,050

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$0.341

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TANS Electronics

Latvia . 3,024 parts In-Stock

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3,024

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UHIMA Technologies

Türkiye . 129 parts In-Stock

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129

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Overview

Experience the superior performance of the NTD78N03R-1G Power FET by Onsemi. With a reputation for excellence, Onsemi delivers top-quality products like this N-CHANNEL transistor with built-in diode, ideal for switching applications. Offering a maximum drain current of 85A and a low on-resistance of 0.009 ohm, this transistor ensures efficient power management. Whether you're in automotive, industrial, or consumer electronics, the NTD78N03R-1G provides the reliability and value you need for your next project. Trust Onsemi for cutting-edge technology and unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher current-carrying capabilities compared to P-channel FETs, making them suitable for high power applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides efficient control of current flow in various electrical circuits.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage at the gate terminal to turn the device on, allowing for precise control over the switching operation.

Avalanche Energy Rating (EAS): 75 mJ

This high avalanche energy rating indicates the FET's ability to handle sudden voltage spikes, making it reliable in demanding and high-stress environments.

Technical Specifications

Power Field Effect Transistors (FET) NTD78N03R-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

75 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

85 A

Maximum Drain Current (ID):

11.3 A

Maximum Drain-Source On Resistance:

.009 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

98 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD78N03R-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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