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NTD70N03R-1G

Onsemi

NTD70N03R-1G by Onsemi

NTD70N03R-1G by Onsemi is a Power FET with N-CHANNEL configuration, ideal for SWITCHING applications. It features a Min DS Breakdown Voltage of 25V, Max Pulsed Drain Current of 140A, and Max Operating Temperature of 150 °C. The transistor has a Max Drain Current of 32A and Max Drain-Source On Resistance of 0.013 ohm.

Median Price

$0.484

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 141,782 parts In-Stock

1+ parts

-

100+ parts

$0.475

1k+ parts

$0.395

10k+ parts

$0.352

141,782

-

$0.475

$0.395

$0.352

Verical

USA . 129,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.493

10k+ parts

$0.440

129,592

-

-

$0.493

$0.440

Distributors (In-Stock)

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Digiode

USA . 918 parts In-Stock

1+ parts

$0.370

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-

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918

$0.370

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Vyrian

USA . 6,743 parts In-Stock

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6,743

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Distributors (Availability)

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Corphita

USA . 1,145 parts In-Stock

1+ parts

$0.351

100+ parts

-

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1,145

$0.351

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Corohmni

South Africa . 55 parts In-Stock

1+ parts

$0.390

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-

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55

$0.390

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AZTECH Wire

Italy . 535 parts In-Stock

1+ parts

$12.670

100+ parts

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535

$12.670

-

-

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Continental Prestige Electronics

USA . 141,782 parts In-Stock

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-

100+ parts

$0.358

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141,782

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$0.358

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Perfect Parts

USA . 20,450 parts In-Stock

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20,450

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Kepictronics

USA . 16,000 parts In-Stock

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16,000

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Authorized Procurement Solutions

USA . 5,500 parts In-Stock

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5,500

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Problanco Electronics

Mexico . 4,279 parts In-Stock

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4,279

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A-Z Elektronik GmbH

Germany . 1,838 parts In-Stock

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1,838

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Kulean Microsystems

USA . 1,680 parts In-Stock

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1,680

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SupplyDigital Components

Austria . 1,559 parts In-Stock

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1,559

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TANS Electronics

Latvia . 770 parts In-Stock

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770

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UHIMA Technologies

Türkiye . 373 parts In-Stock

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373

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Overview

Unlock the power of innovation with the NTD70N03R-1G by Onsemi, a top-tier manufacturer known for its superior quality and reliability. As a leader in Power Field Effect Transistors (FET), this product offers unparalleled performance in switching applications. With a built-in diode and advanced enhancement mode technology, customers can expect seamless operation and maximum efficiency. Experience the value and benefits of this N-CHANNEL transistor with a high pulsing current rating of 140 A and low on-resistance of 0.013 ohms. Elevate your designs with the NTD70N03R-1G and unleash the potential for groundbreaking solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, increasing its durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and lower resistance compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protects against voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in those scenarios.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this FET can handle higher voltage levels without failing.

Maximum Pulsed Drain Current (IDM): 140 A

Capable of handling high current spikes during operation, making it suitable for demanding applications.

Maximum Drain-Source On Resistance: 0.013 ohm

Low on-resistance results in reduced power dissipation and improved efficiency in switching operations.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for industrial environments.

Technical Specifications

Power Field Effect Transistors (FET) NTD70N03R-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

71.7 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

62.8 A

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

140 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD70N03R-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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