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NTD70N03R

Onsemi

NTD70N03R by Onsemi

NTD70N03R by Onsemi is a single N-channel FET with built-in diode for switching applications. It features a max pulsed drain current of 140A, min DS breakdown voltage of 25V, and max operating temperature of 150 °C. This MOSFET has a package style of small outline and terminal finish of tin lead, making it suitable for high-power applications requiring efficient switching capabilities.

Median Price

$0.161

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 45,125 parts In-Stock

1+ parts

-

100+ parts

$0.172

1k+ parts

$0.143

10k+ parts

$0.127

45,125

-

$0.172

$0.143

$0.127

DigiKey

USA . 45,125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.150

45,125

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-

-

$0.150

Distributors (In-Stock)

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Digiode

USA . 1,386 parts In-Stock

1+ parts

$0.134

100+ parts

-

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1,386

$0.134

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Vyrian

USA . 966 parts In-Stock

1+ parts

$0.141

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-

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966

$0.141

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Prism Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Corphita

USA . 758 parts In-Stock

1+ parts

$0.127

100+ parts

-

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758

$0.127

-

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-

Component Stockers USA

USA . 61,412 parts In-Stock

1+ parts

$0.140

100+ parts

$0.130

1k+ parts

$0.120

10k+ parts

$0.120

61,412

$0.140

$0.130

$0.120

$0.120

Corohmni

South Africa . 454 parts In-Stock

1+ parts

$0.141

100+ parts

-

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454

$0.141

-

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Continental Prestige Electronics

USA . 45,125 parts In-Stock

1+ parts

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100+ parts

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$0.129

10k+ parts

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45,125

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-

$0.129

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Kepictronics

USA . 20,000 parts In-Stock

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20,000

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TANS Electronics

Latvia . 7,463 parts In-Stock

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7,463

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Problanco Electronics

Mexico . 6,151 parts In-Stock

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6,151

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A-Z Elektronik GmbH

Germany . 4,529 parts In-Stock

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4,529

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Kulean Microsystems

USA . 4,398 parts In-Stock

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4,398

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SupplyDigital Components

Austria . 2,241 parts In-Stock

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2,241

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UHIMA Technologies

Türkiye . 274 parts In-Stock

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274

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Perfect Parts

USA . 1 parts In-Stock

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1

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Overview

Experience the superior performance and reliability of the NTD70N03R by Onsemi, a leading manufacturer in the industry. This power FET with N-channel configuration is perfect for switching applications, offering maximum efficiency and durability. With a built-in diode and small outline package style, this transistor is ideal for various electronic projects. Benefit from its high-quality construction and enhance your designs with the unmatched value and versatility that the NTD70N03R provides. Trust Onsemi for cutting-edge technology and innovation that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for portable electronic devices.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance and efficiency compared to P-Channel FETs, making this product a great choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and protects other components from voltage spikes, adding to the reliability of the overall system.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast switching speeds and low power loss, making it suitable for high-frequency operation.

Surface Mount: YES

Being surface mountable, this FET is easy to integrate into PCB designs, saving space and enabling automated assembly processes.

Maximum Pulsed Drain Current (IDM): 140 A

The high maximum pulsed drain current capability allows this FET to handle high power levels without damage, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 71.7 mJ

The high avalanche energy rating ensures the FET can withstand voltage spikes and transient events, improving the reliability and longevity of the circuit.

Maximum Power Dissipation (Abs): 1.56 W

With a high maximum power dissipation rating, this FET can efficiently handle power dissipation in high-load conditions, ensuring stable operation.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this FET to operate reliably in a wide range of environmental conditions, making it versatile and suitable for different applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD70N03R attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

71.7 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

62.8 A

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

140 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD70N03R Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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