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NTD78N03G

Onsemi

NTD78N03G by Onsemi

NTD78N03G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 25V DS Breakdown Voltage, 210A IDM, and 0.006 ohm Max RDS(on). The transistor is in ENHANCEMENT MODE and comes in a PLASTIC/EPOXY package with GULL WING terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,774 parts In-Stock

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Digiode

USA . 2,019 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$2.376

100+ parts

$2.352

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$2.257

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500

$2.376

$2.352

$2.257

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AZTECH Wire

Italy . 77 parts In-Stock

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$15.950

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77

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Kepictronics

USA . 20,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,052 parts In-Stock

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Kulean Microsystems

USA . 6,439 parts In-Stock

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TANS Electronics

Latvia . 4,638 parts In-Stock

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Problanco Electronics

Mexico . 2,501 parts In-Stock

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Corphita

USA . 1,486 parts In-Stock

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SupplyDigital Components

Austria . 1,118 parts In-Stock

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Perfect Parts

USA . 896 parts In-Stock

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Corohmni

South Africa . 127 parts In-Stock

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UHIMA Technologies

Türkiye . 4 parts In-Stock

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Overview

Unleash the power of innovation with the NTD78N03G by Onsemi! Crafted with precision and expertise, this Power Field Effect Transistor sets the standard for quality and efficiency. Ideal for a variety of switching applications, this N-CHANNEL transistor offers unparalleled performance and reliability. With a robust design and cutting-edge technology, the NTD78N03G delivers exceptional value and benefits to customers seeking top-notch solutions. Elevate your projects with Onsemi's superior products and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and high-performance applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and efficiency compared to P-channel FETs, making this product suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides reverse voltage protection, enhancing the reliability of the overall system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high efficiency and fast switching speeds, making it suitable for power management systems.

Surface Mount: YES

Surface mount capability allows for easy and compact PCB assembly, saving space and facilitating automated manufacturing processes.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25 V, this FET can handle higher voltages, making it suitable for a wide range of power supply applications.

Package Shape: RECTANGULAR

The rectangular package shape offers convenient mounting and efficient heat dissipation, contributing to overall system reliability and performance.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering points, ensuring reliable electrical connections and easy integration into circuit designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the FET's conductivity, enabling precise switching and optimal power efficiency in various applications.

Maximum Pulsed Drain Current (IDM): 210 A

The high pulsed drain current rating of 210 A enables the FET to handle sudden power surges and high current loads without compromising performance or reliability.

Avalanche Energy Rating (EAS): 722.5 mJ

The high avalanche energy rating ensures reliable operation under high-energy transient conditions, making this FET suitable for demanding industrial and automotive applications.

No. of Terminals: 2

Having only 2 terminals simplifies the circuit layout and reduces the risk of connection errors, improving overall system reliability and ease of installation.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for dense circuit designs, making it ideal for compact electronic devices and applications with limited space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability, low power consumption, and fast switching speeds, ensuring optimal performance in power management applications.

Transistor Element Material: SILICON

Silicon-based transistor element material provides excellent thermal stability and high breakdown voltage, ensuring long-term reliability and performance under various operating conditions.

Terminal Finish: TIN

The use of tin terminal finish enhances solderability and corrosion resistance, ensuring secure electrical connections and long-term reliability in harsh environments.

Maximum Drain Current (ID): 11.4 A

The maximum drain current rating of 11.4 A allows the FET to handle high current loads, making it suitable for a wide range of power switching applications where efficiency and reliability are key.

Maximum Drain-Source On Resistance: 0.006 ohm

The low drain-source on resistance of 0.006 ohms minimizes power loss and heat generation, improving overall efficiency and performance in power management systems.

Terminal Position: SINGLE

With a single terminal position, the FET simplifies circuit design and ensures proper alignment during installation, facilitating ease of use and reducing the risk of errors.

Case Connection: DRAIN

The case connection at the drain terminal provides efficient heat dissipation and allows for easy mounting on heat sinks, ensuring optimal thermal management and reliability in high-power applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures reliable solder joints and prevents component damage during the soldering process, making this FET suitable for lead-free manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) NTD78N03G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

722.5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

11.4 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

210 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD78N03G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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