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NTD78N03R-035

Onsemi

NTD78N03R-035 by Onsemi

NTD78N03R-035 by Onsemi is a Power FET with 25V DS Breakdown Voltage, 98A IDM, and 0.009 ohm RDS(on). It is an N-CHANNEL transistor for SWITCHING applications. The package style is IN-LINE with PLASTIC/EPOXY body material and SILICON element.

Median Price

$0.251

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

$0.251

1k+ parts

$0.208

10k+ parts

$0.186

2,700

-

$0.251

$0.208

$0.186

DigiKey

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.310

10k+ parts

-

2,700

-

-

$0.310

-

Verical

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.232

2,700

-

-

-

$0.232

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 218 parts In-Stock

1+ parts

$0.163

100+ parts

-

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218

$0.163

-

-

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Digiode

USA . 938 parts In-Stock

1+ parts

$0.196

100+ parts

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938

$0.196

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 458 parts In-Stock

1+ parts

$0.163

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-

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458

$0.163

-

-

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Corphita

USA . 764 parts In-Stock

1+ parts

$0.185

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-

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764

$0.185

-

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$0.673

100+ parts

$0.612

1k+ parts

$0.552

10k+ parts

-

2,500

$0.673

$0.612

$0.552

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TANS Electronics

Latvia . 7,853 parts In-Stock

1+ parts

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7,853

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Kulean Microsystems

USA . 5,634 parts In-Stock

1+ parts

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5,634

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SupplyDigital Components

Austria . 3,755 parts In-Stock

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3,755

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Problanco Electronics

Mexico . 3,433 parts In-Stock

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3,433

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Continental Prestige Electronics

USA . 2,700 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.163

10k+ parts

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2,700

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$0.163

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UHIMA Technologies

Türkiye . 751 parts In-Stock

1+ parts

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751

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Overview

Unleash the power of the NTD78N03R-035 by Onsemi, a top-of-the-line Power FET that embodies quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-channel transistor is designed for switching applications with a built-in diode for seamless performance. With a maximum pulsed drain current of 98A and a minimum DS breakdown voltage of 25V, this transistor offers unmatched efficiency and durability. Whether you're looking to enhance your electronic projects or streamline your industrial applications, the NTD78N03R-035 delivers exceptional value and benefits that will exceed your expectations. Upgrade to Onsemi today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the FET.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in the desired direction, making it suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and offers protection against reverse current flow, enhancing the efficiency of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and reliable operation in a variety of circuits.

Minimum DS Breakdown Voltage: 25 V

Can handle higher voltages, making it suitable for applications that require a higher breakdown voltage.

Maximum Pulsed Drain Current (IDM): 98 A

Capable of handling high current spikes, suitable for heavy-duty applications.

Avalanche Energy Rating (EAS): 75 mJ

Can withstand energy spikes, providing a level of protection against voltage surges.

No. of Terminals: 3

Simplifies circuit connectivity and reduces complexity in circuit design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and performance while reducing power consumption in the transistor.

Maximum Drain Current (ID): 11.3 A

Able to handle high continuous current, suitable for applications requiring a stable current flow.

Maximum Drain-Source On Resistance: 0.009 ohm

Low on resistance reduces power loss and heat dissipation, improving overall efficiency.

Technical Specifications

Power Field Effect Transistors (FET) NTD78N03R-035 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

75 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

11.3 A

Maximum Drain-Source On Resistance:

.009 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

98 A

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD78N03R-035 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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