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NTD70N03RT4

Onsemi

NTD70N03RT4 by Onsemi

NTD70N03RT4 by Onsemi is a single N-channel power FET with built-in diode for switching applications. It features a max pulsed drain current of 140A, avalanche energy rating of 71.7mJ, and max operating temperature of 150 °C. Ideal for high-power switching circuits requiring efficient performance in a small outline package.

Median Price

$0.208

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35,298 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

35,298

-

$0.225

$0.186

$0.166

DigiKey

USA . 35,298 parts In-Stock

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$0.190

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$0.190

Verical

USA . 32,500 parts In-Stock

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$0.208

32,500

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$0.208

Distributors (In-Stock)

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Digiode

USA . 1,251 parts In-Stock

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$0.175

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$0.175

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Vyrian

USA . 2,260 parts In-Stock

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$0.184

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$0.184

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Prism Electronics

USA . 1,124 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 239 parts In-Stock

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$0.166

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239

$0.166

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Corohmni

South Africa . 389 parts In-Stock

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$0.184

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389

$0.184

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Continental Prestige Electronics

USA . 35,298 parts In-Stock

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$0.169

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35,298

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$0.169

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Kepictronics

USA . 22,500 parts In-Stock

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22,500

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A-Z Elektronik GmbH

Germany . 7,427 parts In-Stock

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Problanco Electronics

Mexico . 4,965 parts In-Stock

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Perfect Parts

USA . 3,381 parts In-Stock

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3,381

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 2,577 parts In-Stock

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Kulean Microsystems

USA . 2,154 parts In-Stock

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SupplyDigital Components

Austria . 1,487 parts In-Stock

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Assy Fe

Spain . 1,300 parts In-Stock

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GreenTree Electronics

Israel . 360 parts In-Stock

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UHIMA Technologies

Türkiye . 287 parts In-Stock

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Overview

Unlock the power of innovation with the NTD70N03RT4 by Onsemi. Crafted with precision and quality, this Power FET offers a myriad of applications in switching technology. Its N-Channel configuration and built-in diode provide seamless operation while maximizing efficiency. Trust in Onsemi's expertise to deliver top-notch performance and reliability. Elevate your projects with the NTD70N03RT4 and experience the unrivaled value it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, ideal for portable electronic devices.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance in terms of speed and efficiency, making this transistor a great choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and saves space, making this transistor convenient for use in compact applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers high performance and reliability in controlling the flow of current.

Surface Mount: YES

Being surface mountable allows for easier and neater integration into circuit boards, enhancing the overall efficiency and aesthetics of the device.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25 V, this transistor can handle higher voltages, ensuring stable operation in various conditions.

Terminal Form: GULL WING

The gull wing terminal form provides a reliable and secure connection, preventing any potential electrical failures and ensuring long-term performance.

Operating Mode: ENHANCEMENT MODE

Being an enhancement mode transistor allows for easier control of the flow of current, providing more precise and efficient operation in switching applications.

Maximum Pulsed Drain Current (IDM): 140 A

With a high maximum pulsed drain current, this transistor can handle sudden surges of current without overheating, ensuring reliable performance under heavy loads.

Avalanche Energy Rating (EAS): 71.7 mJ

The high avalanche energy rating of 71.7 mJ means that this transistor can withstand energy spikes without damage, making it suitable for rugged environments.

Maximum Drain Current (Abs) (ID): 62.8 A

Having a high maximum drain current of 62.8 A allows for efficient handling of large currents, making this transistor suitable for high-power applications.

No. of Terminals: 2

With only 2 terminals, this transistor is easy to install and use, simplifying the overall circuit design and reducing the risk of wiring errors.

Maximum Power Dissipation (Abs): 1.56 W

The high maximum power dissipation of 1.56 W ensures that this transistor can operate reliably under high power conditions, minimizing the risk of overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, allowing for more compact device designs and efficient use of available space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and fast switching speed, making this transistor suitable for applications where performance is critical.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can operate reliably in high-temperature environments, ensuring consistent performance under various conditions.

Transistor Element Material: SILICON

Silicon is a reliable and durable material for transistor elements, ensuring long-term stability and performance in a wide range of operating conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides a reliable electrical connection and prevents corrosion, ensuring long-term performance and durability of the transistor.

Maximum Drain Current (ID): 32 A

With a high maximum drain current of 32 A, this transistor can handle high current loads without overheating, making it suitable for power-intensive applications.

Maximum Drain-Source On Resistance: 0.013 ohm

Having a low drain-source on resistance of 0.013 ohm minimizes power loss and heat generation, ensuring efficient operation and high performance in various applications.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and reduces the risk of wiring errors, ensuring a reliable connection and consistent performance.

Case Connection: DRAIN

The drain case connection allows for convenient and secure mounting of the transistor, ensuring proper heat dissipation and long-term reliability.

Peak Reflow Temperature °C: 235

With a peak reflow temperature of 235 °C, this transistor can withstand high-temperature soldering processes, ensuring reliable and durable connections in manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) NTD70N03RT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

71.7 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

62.8 A

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

140 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD70N03RT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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