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NTD70N03R-001G

Onsemi

NTD70N03R-001G by Onsemi

NTD70N03R-001G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a Max Drain Current of 32A, Min DS Breakdown Voltage of 25V, and Max Pulsed Drain Current of 140A. This transistor operates in ENHANCEMENT MODE and has an Avalanche Energy Rating of 71.7mJ, making it ideal for high-power switching circuits.

Median Price

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Digiode

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Austria . 8,288 parts In-Stock

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TANS Electronics

Latvia . 6,479 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

Mexico . 1,274 parts In-Stock

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Corphita

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Corohmni

South Africa . 275 parts In-Stock

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UHIMA Technologies

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Overview

Unleash the power of innovation with the NTD70N03R-001G by Onsemi. This high-quality Power FET offers unparalleled performance in switching applications, thanks to its N-CHANNEL design and built-in diode configuration. With a compact rectangular package and GULL WING terminals, this transistor is perfect for space-constrained designs. Trust Onsemi's expertise in semiconductor technology to deliver reliable products that exceed expectations. Elevate your projects with the NTD70N03R-001G and experience the benefits of enhanced efficiency and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Offers efficient conduction of current in the specified direction, enhancing performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by incorporating a diode within the transistor.

Transistor Application: SWITCHING

Ideal for applications requiring fast switching speeds and high efficiency.

Package Shape: RECTANGULAR

Facilitates easy mounting and installation in various electronic devices.

Operating Mode: ENHANCEMENT MODE

Allows for precise control of the transistor's conductivity, improving overall performance.

Maximum Pulsed Drain Current (IDM): 140 A

Capable of handling high current pulses, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 71.7 mJ

Provides protection against avalanches and ensures reliable operation under stress.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and low power consumption, making it energy-efficient.

Maximum Drain Current (ID): 32 A

Handles high continuous current, allowing for reliable performance under load.

Maximum Drain-Source On Resistance: 0.013 ohm

Low on-resistance minimizes power loss and enhances efficiency of the transistor.

Technical Specifications

Power Field Effect Transistors (FET) NTD70N03R-001G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

71.7 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

140 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD70N03R-001G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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