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NTD6600N-1G

Onsemi

NTD6600N-1G by Onsemi

NTD6600N-1G by Onsemi is a single N-channel power FET with built-in diode, ideal for switching applications. It features a min DS breakdown voltage of 100V, max pulsed drain current of 44A, and max drain-source on resistance of 0.146 ohm. This MOSFET operates in enhancement mode with an avalanche energy rating of 72mJ, making it suitable for high-power applications.

Median Price

$0.524

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,425 parts In-Stock

1+ parts

-

100+ parts

$0.515

1k+ parts

$0.428

10k+ parts

$0.381

1,425

-

$0.515

$0.428

$0.381

Verical

USA . 1,425 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.534

10k+ parts

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1,425

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-

$0.534

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Distributors (In-Stock)

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Digiode

USA . 1,574 parts In-Stock

1+ parts

$0.401

100+ parts

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1,574

$0.401

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Vyrian

USA . 8,804 parts In-Stock

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8,804

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Distributors (Availability)

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Corphita

USA . 742 parts In-Stock

1+ parts

$0.380

100+ parts

-

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742

$0.380

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Corohmni

South Africa . 426 parts In-Stock

1+ parts

$0.422

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426

$0.422

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Component Stockers USA

USA . 1,549 parts In-Stock

1+ parts

$0.440

100+ parts

$0.410

1k+ parts

$0.370

10k+ parts

-

1,549

$0.440

$0.410

$0.370

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AZTECH Wire

Italy . 822 parts In-Stock

1+ parts

$20.030

100+ parts

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822

$20.030

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 11,843 parts In-Stock

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11,843

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Kulean Microsystems

USA . 7,930 parts In-Stock

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7,930

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TANS Electronics

Latvia . 5,618 parts In-Stock

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5,618

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Problanco Electronics

Mexico . 2,573 parts In-Stock

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2,573

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Continental Prestige Electronics

USA . 1,425 parts In-Stock

1+ parts

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$0.388

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1,425

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$0.388

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SupplyDigital Components

Austria . 1,275 parts In-Stock

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1,275

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UHIMA Technologies

Türkiye . 676 parts In-Stock

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676

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Overview

Unleash the power of innovation with the NTD6600N-1G by Onsemi. This high-quality Power FET offers unparalleled performance and reliability, making it the ideal choice for a wide range of switching applications. With a single configuration and built-in diode, this transistor provides maximum efficiency and ease of use. Trust in Onsemi's reputation for excellence and discover the value and benefits that the NTD6600N-1G can bring to your projects. Elevate your designs with this cutting-edge technology and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring reliable performance in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in reducing reverse recovery losses and ensures efficient switching operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast turn-on and turn-off times, making it ideal for power management and control.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle higher voltages, making it suitable for applications that require high voltage handling capabilities.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and installation on circuit boards, saving space and simplifying the design process.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and mechanical stability, ensuring reliable performance in harsh environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control of the on/off state, providing efficient switching capabilities and reducing power consumption.

Maximum Pulsed Drain Current (IDM): 44 A

High pulsed drain current rating allows for reliable operation under peak load conditions, making this FET suitable for high-power applications.

Avalanche Energy Rating (EAS): 72 mJ

High avalanche energy rating ensures the FET can withstand transient voltage spikes, providing protection against voltage surges and enhancing reliability.

No. of Terminals: 3

Three terminals provide easy connectivity and control, enabling versatile application in various circuit configurations.

Package Style (Meter): IN-LINE

In-line package style offers space-saving design and easy integration into circuit layouts, allowing for compact and efficient system design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high-speed operation and low power consumption, making this FET suitable for energy-efficient applications.

Transistor Element Material: SILICON

Silicon material ensures high reliability and temperature stability, making this FET suitable for operation in harsh environmental conditions.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides corrosion resistance and solderability, ensuring long-term reliability and ease of assembly in manufacturing processes.

Maximum Drain Current (ID): 12 A

High maximum drain current rating allows for efficient power handling and reliable operation in high-current applications.

Maximum Drain-Source On Resistance: 0.146 ohm

Low on-resistance minimizes power losses and improves efficiency, making this FET suitable for high-current applications where low voltage drop is crucial.

Terminal Position: SINGLE

Single terminal position simplifies circuit connections and reduces complexity in system design, ensuring ease of integration and maintenance.

Case Connection: DRAIN

Drain connection enables easy integration into existing circuit layouts, allowing for versatile application and compatibility with different circuit configurations.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand reflow soldering process for up to 40 seconds at peak temperature, ensuring reliable and consistent solder joint formation during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with lead-free soldering processes, making this FET suitable for RoHS-compliant manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) NTD6600N-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

72 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.146 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

44 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD6600N-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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