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NTD50N03RT4

Onsemi

NTD50N03RT4 by Onsemi

NTD50N03RT4 by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a Max Pulsed Drain Current of 180A, Min DS Breakdown Voltage of 25V, and Max Drain Current of 7.8A. The transistor has a built-in diode and operates in ENHANCEMENT MODE, making it ideal for high-power switching circuits.

Median Price

$0.132

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

2,500

-

$0.132

$0.110

$0.098

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,195 parts In-Stock

1+ parts

$0.103

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-

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1,195

$0.103

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Bristol Electronics

USA . 2,491 parts In-Stock

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2,491

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Vyrian

USA . 2,135 parts In-Stock

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2,135

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Distributors (Availability)

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Corphita

USA . 562 parts In-Stock

1+ parts

$0.097

100+ parts

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562

$0.097

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Corohmni

South Africa . 443 parts In-Stock

1+ parts

$0.108

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443

$0.108

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AZTECH Wire

Italy . 614 parts In-Stock

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$20.980

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614

$20.980

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Kulean Microsystems

USA . 7,126 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,097 parts In-Stock

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7,097

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Problanco Electronics

Mexico . 6,079 parts In-Stock

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SupplyDigital Components

Austria . 5,084 parts In-Stock

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5,084

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UHIMA Technologies

Türkiye . 754 parts In-Stock

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TANS Electronics

Latvia . 196 parts In-Stock

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Overview

Unlock the power of efficiency with the NTD50N03RT4 by Onsemi. Crafted with precision and expertise, this Power FET offers unparalleled performance in switching applications. With a focus on quality and reliability, Onsemi delivers a product that exceeds expectations. Ideal for a wide range of uses, this N-CHANNEL transistor is designed to optimize functionality while minimizing energy consumption. Experience the benefits of enhanced mode operation and built-in diode configuration, providing value and versatility for all your needs. Elevate your projects with the NTD50N03RT4 and discover a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, ensuring a longer lifespan and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are commonly used in switching applications and offer high efficiency and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and saves space, making it convenient for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast response times and high efficiency.

Surface Mount: YES

Being surface mountable allows for easy and compact assembly on circuit boards, ideal for modern electronics.

Minimum DS Breakdown Voltage: 25 V

With a high breakdown voltage, this transistor can handle higher voltages without risk of damage.

Package Shape: RECTANGULAR

The rectangular shape provides a standard and easily mountable form factor for integration into various devices.

Terminal Form: GULL WING

The gull wing terminal form offers secure solder connections and ease of handling during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer improved control and lower off-state leakage current for efficient operation.

Maximum Pulsed Drain Current (IDM): 180 A

With a high pulse current rating, this transistor can handle momentary surges in current without failure.

Avalanche Energy Rating (EAS): 20 mJ

The avalanche energy rating indicates the ability to withstand high energy spikes, ensuring reliability in harsh conditions.

No. of Terminals: 2

Having only 2 terminals simplifies the connection and integration of the transistor in circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, especially in compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency, low power consumption, and fast switching speeds.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material known for its stability and performance in electronic components.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and reliable connections for long-lasting performance.

Maximum Drain Current (ID): 7.8 A

With a high drain current rating, this transistor can handle large currents without overheating or failure.

Maximum Drain-Source On Resistance: 0.014 ohm

The low on-resistance ensures minimal power loss and efficient operation in switching applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the connection and orientation of the transistor in a circuit.

Case Connection: DRAIN

The drain case connection allows for easy heat dissipation, ensuring the transistor stays within operating temperatures.

Peak Reflow Temperature °C: 235

With a high peak reflow temperature, this transistor can withstand the soldering process without damage or failure.

Technical Specifications

Power Field Effect Transistors (FET) NTD50N03RT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

20 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

7.8 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

180 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD50N03RT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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