Loading...

NTD50N03R-1G

Onsemi

NTD50N03R-1G by Onsemi

NTD50N03R-1G by Onsemi is a Power FET with 25V DS Breakdown Voltage, 180A IDM, and 0.014 ohm RDS(on). Ideal for SWITCHING applications due to its N-CHANNEL configuration and ENHANCEMENT MODE operation. Features a SINGLE package with BUILT-IN DIODE in RECTANGULAR shape.

Median Price

$0.134

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,609 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

5,609

-

$0.132

$0.110

$0.098

Verical

USA . 4,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.137

4,705

-

-

-

$0.137

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,064 parts In-Stock

1+ parts

$0.103

100+ parts

-

1k+ parts

-

10k+ parts

-

2,064

$0.103

-

-

-

Vyrian

USA . 3,766 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,766

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,002 parts In-Stock

1+ parts

$0.092

100+ parts

-

1k+ parts

-

10k+ parts

-

5,002

$0.092

-

-

-

Corphita

USA . 662 parts In-Stock

1+ parts

$0.097

100+ parts

-

1k+ parts

-

10k+ parts

-

662

$0.097

-

-

-

Corohmni

South Africa . 491 parts In-Stock

1+ parts

$0.108

100+ parts

-

1k+ parts

-

10k+ parts

-

491

$0.108

-

-

-

AZTECH Wire

Italy . 604 parts In-Stock

1+ parts

$11.940

100+ parts

-

1k+ parts

-

10k+ parts

-

604

$11.940

-

-

-

Metaverse IC Inc.

Canada . 38,652 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

38,652

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,972 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,972

-

-

-

-

Problanco Electronics

Mexico . 7,925 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,925

-

-

-

-

Continental Prestige Electronics

USA . 5,609 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.099

10k+ parts

-

5,609

-

-

$0.099

-

A-Z Elektronik GmbH

Germany . 4,544 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,544

-

-

-

-

SupplyDigital Components

Austria . 4,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,083

-

-

-

-

TANS Electronics

Latvia . 2,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,802

-

-

-

-

UHIMA Technologies

Türkiye . 890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

890

-

-

-

-

Kulean Microsystems

USA . 865 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

865

-

-

-

-

Overview

Enhance the performance of your electronic devices with the NTD50N03R-1G by Onsemi. As a leading manufacturer in the industry, Onsemi's Power Field Effect Transistors are known for their reliability and efficiency. This N-channel transistor with a built-in diode is ideal for switching applications, offering a maximum drain current of 7.8A and a low drain-source on resistance of 0.014 ohm. Whether you're looking to upgrade your power supply or improve your circuit design, the NTD50N03R-1G provides value, durability, and enhanced performance that will benefit your projects immensely. Choose Onsemi for quality you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, ensuring a long lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this product a good choice for many applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, making it efficient and reliable for this purpose.

Minimum DS Breakdown Voltage: 25 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, ensuring safety and reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control and efficiency in switching operations, making this product suitable for various applications.

Maximum Pulsed Drain Current (IDM): 180 A

High pulsed drain current rating allows for handling sudden spikes in current, making this FET suitable for demanding applications.

Avalanche Energy Rating (EAS): 20 mJ

With a high avalanche energy rating, this FET can withstand high energy spikes, ensuring reliability in harsh conditions.

Maximum Drain Current (ID): 7.8 A

High maximum drain current allows for handling high current loads, making this product versatile in various applications.

Maximum Drain-Source On Resistance: 0.014 ohm

Low on-resistance leads to lower power dissipation and higher efficiency, making this FET suitable for power management applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD50N03R-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

20 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

7.8 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

180 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD50N03R-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20