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NTD4905NT4G

Onsemi

NTD4905NT4G by Onsemi

NTD4905NT4G by Onsemi is an N-CHANNEL Power FET with a 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 264A and 0.007 ohm RDS(ON), suitable for high-power operations. This METAL-OXIDE SEMICONDUCTOR FET comes in a PLASTIC/EPOXY package with GULL WING terminals, designed for surface mount installations.

Median Price

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2

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 1,907 parts In-Stock

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AZTECH Wire

Italy . 296 parts In-Stock

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$21.010

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Component Stockers USA

USA . 551 parts In-Stock

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$99.990

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Kepictronics

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Kulean Microsystems

USA . 4,611 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 1,885 parts In-Stock

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Problanco Electronics

Mexico . 1,632 parts In-Stock

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TANS Electronics

Latvia . 1,470 parts In-Stock

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Corphita

USA . 1,138 parts In-Stock

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UHIMA Technologies

Türkiye . 931 parts In-Stock

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Corohmni

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Overview

Unlock the power of innovation with the NTD4905NT4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch Power Field Effect Transistors designed for SWITCHING applications. With a single configuration and built-in diode, this N-CHANNEL transistor offers unmatched performance and reliability. Say goodbye to power limitations and hello to seamless functionality with the NTD4905NT4G. Experience the value and benefits it brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are commonly used for high-side switching applications due to their lower ON-resistance and higher efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against voltage spikes and reverse current flow, enhancing the reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and efficient power handling capabilities.

Surface Mount: YES

The surface mount capability makes it easy to integrate this FET into compact and space-constrained electronic designs.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can reliably handle high voltage applications without breakdown or damage.

Maximum Pulsed Drain Current (IDM): 264 A

The high pulsed drain current rating of 264A allows for temporary surges in current without damaging the FET.

Avalanche Energy Rating (EAS): 61 mJ

The high avalanche energy rating of 61mJ indicates the FET's ability to withstand energy spikes and transients without failure.

Maximum Drain Current (ID): 12 A

The maximum drain current rating of 12A ensures reliable power handling capabilities for various applications.

Maximum Drain-Source On Resistance: 0.007 ohm

The low on-resistance of 0.007 ohm reduces power losses and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD4905NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

61 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

264 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4905NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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