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NTBL082N65S3HF

Onsemi

NTBL082N65S3HF by Onsemi

NTBL082N65S3HF by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 100A IDM, 510mJ EAS, and 0.082 ohm RDS(ON). Operating from -55 to 150 °C, it comes in a small outline package with matte tin finish.

Median Price

$5.325

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,970 parts In-Stock

1+ parts

$4.887

100+ parts

$4.620

1k+ parts

$4.421

10k+ parts

-

1,970

$4.887

$4.620

$4.421

-

Arrow

USA . 1,930 parts In-Stock

1+ parts

$5.262

100+ parts

$4.942

1k+ parts

$4.703

10k+ parts

-

1,930

$5.262

$4.942

$4.703

-

Mouser Electronics

USA . 1,688 parts In-Stock

1+ parts

$6.000

100+ parts

$4.940

1k+ parts

$4.930

10k+ parts

-

1,688

$6.000

$4.940

$4.930

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Verical

USA . 11,192 parts In-Stock

1+ parts

-

100+ parts

$5.388

1k+ parts

$4.825

10k+ parts

$4.537

11,192

-

$5.388

$4.825

$4.537

Rochester

USA . 11,192 parts In-Stock

1+ parts

-

100+ parts

$4.310

1k+ parts

$3.860

10k+ parts

$3.630

11,192

-

$4.310

$3.860

$3.630

RS (Exports)

UK . 2,000 parts In-Stock

1+ parts

-

100+ parts

$5.880

1k+ parts

$5.030

10k+ parts

-

2,000

-

$5.880

$5.030

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,330 parts In-Stock

1+ parts

$4.550

100+ parts

-

1k+ parts

-

10k+ parts

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2,330

$4.550

-

-

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Vyrian

USA . 984 parts In-Stock

1+ parts

$4.652

100+ parts

-

1k+ parts

-

10k+ parts

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984

$4.652

-

-

-

Flip Electronics

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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50,000

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 239 parts In-Stock

1+ parts

$4.311

100+ parts

-

1k+ parts

-

10k+ parts

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239

$4.311

-

-

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Corohmni

South Africa . 205 parts In-Stock

1+ parts

$4.652

100+ parts

-

1k+ parts

-

10k+ parts

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205

$4.652

-

-

-

Continental Prestige Electronics

USA . 1,990 parts In-Stock

1+ parts

$8.140

100+ parts

$4.280

1k+ parts

$4.130

10k+ parts

-

1,990

$8.140

$4.280

$4.130

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Microchip USA

USA . 3,667 parts In-Stock

1+ parts

$30.877

100+ parts

-

1k+ parts

-

10k+ parts

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3,667

$30.877

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-

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SupplyDigital Components

Austria . 8,269 parts In-Stock

1+ parts

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100+ parts

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8,269

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Kulean Microsystems

USA . 7,562 parts In-Stock

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7,562

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Perfect Parts

USA . 6,406 parts In-Stock

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6,406

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TANS Electronics

Latvia . 2,493 parts In-Stock

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2,493

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Problanco Electronics

Mexico . 1,474 parts In-Stock

1+ parts

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1,474

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UHIMA Technologies

Türkiye . 141 parts In-Stock

1+ parts

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141

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Overview

Experience the power of superior performance with the NTBL082N65S3HF by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors designed for switching applications with precision and efficiency. The NTBL082N65S3HF offers reliability and durability, ensuring long-lasting functionality in various electronic devices. With its N-CHANNEL configuration and built-in diode, this transistor provides seamless operation and enhanced performance. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the NTBL082N65S3HF and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and resistance to environmental factors, making this product suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs have lower ON-state resistance and higher electron mobility, resulting in better performance and efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling of inductive loads, ensuring protection against voltage spikes and enhancing the overall reliability of the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low ON-state resistance, making it ideal for high-frequency and high-efficiency circuits.

Surface Mount: YES

Being surface mountable means easy and convenient integration into PCB designs, saving space and allowing for automated assembly processes.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage rating of 650V ensures reliable operation in high-voltage applications, providing a safety margin for voltage spikes or transients.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and mounting, enabling easy integration into electronic systems.

Terminal Form: FLAT

The flat terminal form ensures secure and stable connections during installation, preventing any intermittent contact issues that may affect circuit performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage to turn on, offering better control over the switching operation and reducing the chances of accidental turn-on.

Maximum Pulsed Drain Current (IDM): 100 A

With a high pulsed drain current rating of 100A, this FET can handle short-term power surges or peaks without the risk of damage, ensuring robust performance in demanding applications.

Avalanche Energy Rating (EAS): 510 mJ

The high avalanche energy rating indicates the FET's ability to withstand energy spikes and breakdown conditions, enhancing overall reliability and longevity.

No. of Terminals: 8

Having 8 terminals provides flexibility in circuit connection options and allows for enhanced functionality in complex electronic systems.

Maximum Power Dissipation (Abs): 313 W

The high power dissipation rating of 313W ensures the FET can handle high power levels without overheating, maintaining stable operation under demanding conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic designs where size constraints are a concern.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Using metal-oxide semiconductor technology ensures high efficiency and low leakage currents, making this FET suitable for power management applications requiring precise control.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows for reliable operation in elevated temperature environments, offering versatility in application scenarios.

Transistor Element Material: SILICON

Silicon-based transistor elements provide high reliability, temperature stability, and performance consistency, ensuring long-term functionality and consistent operation.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C enables the FET to operate in cold environments without performance degradation, making it suitable for various temperature conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and corrosion resistance, ensuring secure connections and long-term reliability in various operating environments.

Maximum Drain Current (ID): 40 A

The maximum drain current rating of 40A indicates the FET's ability to handle high continuous current levels, making it suitable for power switching applications requiring high current capacity.

Maximum Drain-Source On Resistance: 0.082 ohm

The low drain-source on resistance of 0.082 ohms reduces power losses and improves efficiency in the circuit, making this FET ideal for high-performance applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit connection and layout, ensuring ease of installation and reducing the risk of wiring errors.

Case Connection: DRAIN

The drain case connection allows for efficient heat dissipation and thermal management, ensuring the FET operates within its temperature limits for reliable performance.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly processes, preventing damage to the FET due to excessive heat exposure.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C enables secure solder joints and reliable connections, ensuring the FET maintains electrical conductivity under varying temperature conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTBL082N65S3HF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

510 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.082 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTBL082N65S3HF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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