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NTBLS1D1N08H

Onsemi

NTBLS1D1N08H by Onsemi

NTBLS1D1N08H by Onsemi is a N-CHANNEL Power FET with 80V DS Breakdown Voltage. It features a max IDM of 900A and EAS of 1580mJ, suitable for high-power applications. With an operating temperature range from -55 to 175°C, it is ideal for power management in various electronic devices.

Median Price

$7.580

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,703 parts In-Stock

1+ parts

$7.580

100+ parts

$3.950

1k+ parts

$3.710

10k+ parts

$3.690

2,703

$7.580

$3.950

$3.710

$3.690

DigiKey

USA . 2,836 parts In-Stock

1+ parts

$7.640

100+ parts

$3.945

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$3.223

2,836

$7.640

$3.945

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$3.223

Verical

USA . 4,000 parts In-Stock

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$3.683

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$3.683

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Digiode

USA . 1,959 parts In-Stock

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$5.890

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Nova Conductors

Japan . 29 parts In-Stock

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$6.198

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Sensible Micro Corp

USA . 42,000 parts In-Stock

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Chip Stock

USA . 3,412 parts In-Stock

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Vyrian

USA . 1,789 parts In-Stock

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Flip Electronics

USA . 302 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$0.844

100+ parts

$0.768

1k+ parts

$0.692

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-

2,500

$0.844

$0.768

$0.692

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Ampacity Inc.

Singapore . 3,710 parts In-Stock

1+ parts

$3.130

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Corohmni

South Africa . 119 parts In-Stock

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$3.294

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Corphita

USA . 478 parts In-Stock

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$5.580

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478

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Continental Prestige Electronics

USA . 3,290 parts In-Stock

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$6.169

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$6.045

3,290

$6.169

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$6.045

Netroflash

USA . 2,000 parts In-Stock

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$6.198

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QUARKTWIN TECHNOLOGY LTD

USA . 16,059 parts In-Stock

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Lixinc

USA . 10,318 parts In-Stock

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Infinite Electronics LLP (Excess)

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Microchip USA

USA . 9,914 parts In-Stock

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Problanco Electronics

Mexico . 7,821 parts In-Stock

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Kulean Microsystems

USA . 5,347 parts In-Stock

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Robosynatics

Brazil . 4,625 parts In-Stock

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Lucentia Tech

USA . 4,625 parts In-Stock

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$1.718

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$1.683

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$1.683

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$1.683

Perfect Parts

USA . 4,368 parts In-Stock

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Argo Parts USA

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SupplyDigital Components

Austria . 2,876 parts In-Stock

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TANS Electronics

Latvia . 1,257 parts In-Stock

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Futuretech Components

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UHIMA Technologies

Türkiye . 795 parts In-Stock

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Authorized Procurement Solutions

USA . 60 parts In-Stock

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Overview

Experience superior performance and reliability with the NTBLS1D1N08H by Onsemi, a top-of-the-line Power FET that offers unparalleled quality and efficiency. Manufactured by Onsemi, a trusted name in the industry, this N-channel transistor is perfect for a wide range of applications. With a built-in diode and high breakdown voltage, this transistor ensures optimal functionality and durability. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations. Choose the NTBLS1D1N08H for exceptional value and performance that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the FET, making it durable and reliable in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, offering high efficiency and lower ON resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances circuit protection and efficiency, reducing the need for additional components in the design.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort during production.

Maximum Pulsed Drain Current (IDM): 900 A

High pulsed drain current capability allows the FET to handle large current spikes and surges without failure.

Maximum Power Dissipation (Abs): 311 W

High power dissipation rating ensures the FET can operate at high power levels without overheating, improving overall reliability.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows the FET to function in demanding environments with temperature variations.

Maximum Feedback Capacitance (Crss): 49 pF

Low feedback capacitance reduces interference and improves stability in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) NTBLS1D1N08H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1580 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

351 A

Maximum Drain Current (ID):

351 A

Maximum Drain-Source On Resistance:

.00105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

49 pF

JEDEC-95 Code:

MO-299A

JESD-30 Code:

R-PSSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTBLS1D1N08H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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