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NTBLS1D5N08MC

Onsemi

NTBLS1D5N08MC by Onsemi

NTBLS1D5N08MC by Onsemi is a N-CHANNEL Power FET with 80V DS Breakdown Voltage and 4487A IDM. Ideal for applications requiring high power dissipation, such as in power supplies or motor control systems. Features include 298A ID, 0.00153 ohm RDS(on), and -55 to 150 °C operating temperature range.

Median Price

$8.810

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5,637 parts In-Stock

1+ parts

$8.810

100+ parts

$4.770

1k+ parts

$4.680

10k+ parts

$4.510

5,637

$8.810

$4.770

$4.680

$4.510

DigiKey

USA . 1,395 parts In-Stock

1+ parts

$8.810

100+ parts

$4.769

1k+ parts

-

10k+ parts

$3.896

1,395

$8.810

$4.769

-

$3.896

Newark

USA . 3,942 parts In-Stock

1+ parts

$9.070

100+ parts

$4.910

1k+ parts

$4.590

10k+ parts

-

3,942

$9.070

$4.910

$4.590

-

Verical

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.453

12,000

-

-

-

$4.453

Rochester

USA . 610 parts In-Stock

1+ parts

-

100+ parts

$3.900

1k+ parts

$3.490

10k+ parts

$3.280

610

-

$3.900

$3.490

$3.280

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,391 parts In-Stock

1+ parts

$3.896

100+ parts

-

1k+ parts

-

10k+ parts

-

1,391

$3.896

-

-

-

Ozdisan Elektronik

Türkiye . 490 parts In-Stock

1+ parts

$4.065

100+ parts

-

1k+ parts

-

10k+ parts

-

490

$4.065

-

-

-

Digiode

USA . 921 parts In-Stock

1+ parts

$4.114

100+ parts

-

1k+ parts

-

10k+ parts

-

921

$4.114

-

-

-

Flip Electronics

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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12,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 302 parts In-Stock

1+ parts

$3.896

100+ parts

-

1k+ parts

-

10k+ parts

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302

$3.896

-

-

-

Corphita

USA . 1,380 parts In-Stock

1+ parts

$3.897

100+ parts

-

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10k+ parts

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1,380

$3.897

-

-

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Microchip USA

USA . 2,085 parts In-Stock

1+ parts

$27.918

100+ parts

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2,085

$27.918

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-

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Kulean Microsystems

USA . 6,844 parts In-Stock

1+ parts

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6,844

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TANS Electronics

Latvia . 4,426 parts In-Stock

1+ parts

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4,426

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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SupplyDigital Components

Austria . 2,792 parts In-Stock

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2,792

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Problanco Electronics

Mexico . 849 parts In-Stock

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849

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iodParts Technologies Inc.

India . 506 parts In-Stock

1+ parts

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506

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GreenTree Electronics

Israel . 490 parts In-Stock

1+ parts

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490

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UHIMA Technologies

Türkiye . 385 parts In-Stock

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385

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Overview

Experience superior performance and reliability with the NTBLS1D5N08MC by Onsemi, a leading manufacturer in the industry. This Power FET boasts a single configuration with a built-in diode, making it ideal for a wide range of applications. From power supplies to motor control, this N-CHANNEL transistor offers high efficiency and durability. With a maximum pulsed drain current of 4487 A and a minimum DS breakdown voltage of 80 V, this product delivers exceptional value and benefits to customers seeking top-notch quality and performance. Trust Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a good balance of durability and cost-effectiveness, making the product reliable and affordable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this product a good choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances efficiency, making the product suitable for applications requiring rectification.

Surface Mount: YES

Surface mount technology allows for easy integration into compact electronic devices, saving space and enabling high-density designs.

Minimum DS Breakdown Voltage: 80 V

The high breakdown voltage rating ensures robustness and reliability in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy mounting and placement on circuit boards, optimizing space utilization.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer higher performance and efficiency, making this product suitable for demanding applications.

Maximum Pulsed Drain Current (IDM): 4487 A

The high pulsed drain current rating allows for handling of large transient currents, making the product ideal for high-power applications.

Avalanche Energy Rating (EAS): 1441 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes, ensuring reliability in harsh operating conditions.

Maximum Drain Current (Abs) (ID): 298 A

The high drain current rating allows for efficient power handling, making the product suitable for high-current applications.

Maximum Power Dissipation (Abs): 250 W

The high power dissipation rating ensures reliable operation under high load conditions, making the product suitable for power electronics applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making the product a suitable choice for demanding applications.

Maximum Operating Temperature: 150 °C

The high operating temperature rating allows the FET to perform reliably in elevated temperature environments, ensuring long-term durability.

Minimum Operating Temperature: -55 °C

The wide operating temperature range makes the product suitable for use in both extreme cold and hot environments.

Maximum Drain-Source On Resistance: 0.00153 ohm

The low on-resistance minimizes power loss and heat dissipation, enhancing efficiency in high-current applications.

Technical Specifications

Power Field Effect Transistors (FET) NTBLS1D5N08MC attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1441 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

298 A

Maximum Drain Current (ID):

298 A

Maximum Drain-Source On Resistance:

.00153 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

82 pF

JEDEC-95 Code:

MO-299A

JESD-30 Code:

R-PSSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

4487 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTBLS1D5N08MC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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