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NTBL095N65S3H

Onsemi

NTBL095N65S3H by Onsemi

NTBL095N65S3H by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, 84A IDM, and 0.095 ohm RDS(ON). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at -55 to 150 °C.

Median Price

$3.410

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 8,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$3.410

10k+ parts

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8,000

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$3.410

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Flip Electronics (Authorized)

USA . 8,000 parts In-Stock

1+ parts

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8,000

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Rochester

USA . 3,258 parts In-Stock

1+ parts

-

100+ parts

$3.410

1k+ parts

$3.050

10k+ parts

$2.870

3,258

-

$3.410

$3.050

$2.870

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,012 parts In-Stock

1+ parts

$3.410

100+ parts

-

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2,012

$3.410

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Digiode

USA . 2,137 parts In-Stock

1+ parts

$3.600

100+ parts

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2,137

$3.600

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Flip Electronics

USA . 8,000 parts In-Stock

1+ parts

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100+ parts

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8,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 72 parts In-Stock

1+ parts

$3.410

100+ parts

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72

$3.410

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Corphita

USA . 519 parts In-Stock

1+ parts

$3.411

100+ parts

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1k+ parts

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519

$3.411

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Microchip USA

USA . 5,154 parts In-Stock

1+ parts

$24.465

100+ parts

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5,154

$24.465

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Problanco Electronics

Mexico . 7,445 parts In-Stock

1+ parts

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7,445

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Kulean Microsystems

USA . 5,797 parts In-Stock

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5,797

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SupplyDigital Components

Austria . 4,577 parts In-Stock

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4,577

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TANS Electronics

Latvia . 819 parts In-Stock

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819

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UHIMA Technologies

Türkiye . 756 parts In-Stock

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756

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Overview

Get ready to experience unparalleled power and efficiency with the NTBL095N65S3H by Onsemi. As a leader in the industry, Onsemi's Power Field Effect Transistors (FET) are known for their high-quality construction and reliable performance. Ideal for switching applications, this N-channel transistor offers a maximum DS breakdown voltage of 650V and a maximum drain current of 30A, making it perfect for a wide range of electronic devices. With a package shape that is both compact and durable, this transistor is designed to handle even the most demanding tasks with ease. Upgrade your electronics with the NTBL095N65S3H and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and long-lasting performance of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher efficiency and faster switching speeds, making them ideal for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and protects the FET from voltage spikes, enhancing its overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers optimized performance in control and power management systems.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, making it suitable for compact electronic devices.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage levels, ensuring reliable operation in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact form factor, making it space-efficient for various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control and efficient switching, making them suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 84 A

The high pulsed drain current rating allows for handling surge currents, making this FET suitable for high-power applications.

Avalanche Energy Rating (EAS): 284 mJ

The high avalanche energy rating ensures the FET can withstand voltage spikes and transient conditions, improving overall reliability.

No. of Terminals: 8

Having 8 terminals provides flexibility in circuit connections and allows for versatile applications.

Maximum Power Dissipation (Abs): 208 W

With a high power dissipation rating, this FET can handle high power levels without overheating, ensuring reliable operation.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, making this FET a good choice for various applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature rating, this FET can withstand elevated temperatures, ensuring reliable performance in harsh environments.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, making this FET a stable and long-lasting choice for electronic applications.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this FET can operate in cold environments without compromising performance.

Maximum Drain Current (ID): 30 A

The high drain current rating allows for handling high current loads, making this FET suitable for power management applications.

Maximum Drain-Source On Resistance: 0.095 ohm

With a low drain-source on resistance, this FET minimizes power loss and improves efficiency in switching applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit connections and ensures easy integration in electronic systems.

Case Connection: DRAIN

The drain case connection simplifies heat dissipation and ensures efficient cooling for the FET, enhancing its overall performance.

Technical Specifications

Power Field Effect Transistors (FET) NTBL095N65S3H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

284 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-F8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTBL095N65S3H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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