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NLV74VHC32DR2G

Onsemi

NLV74VHC32DR2G by Onsemi

NLV74VHC32DR2G by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 13ns propagation delay. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 2-5.5V. This small outline package has dual terminals and matte tin finish for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,573 parts In-Stock

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Digiode

USA . 539 parts In-Stock

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Microchip USA

USA . 5,169 parts In-Stock

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$1.431

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$1.431

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AZTECH Wire

Italy . 444 parts In-Stock

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$15.750

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Ampacity Inc.

Singapore . 497 parts In-Stock

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$65.000

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Kulean Microsystems

USA . 7,552 parts In-Stock

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SupplyDigital Components

Austria . 6,615 parts In-Stock

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Problanco Electronics

Mexico . 6,196 parts In-Stock

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TANS Electronics

Latvia . 4,246 parts In-Stock

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Corphita

USA . 1,265 parts In-Stock

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Vigor

Singapore . 826 parts In-Stock

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UHIMA Technologies

Türkiye . 268 parts In-Stock

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Corohmni

South Africa . 50 parts In-Stock

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Overview

Unlock the power of efficient logic gates with the NLV74VHC32DR2G by Onsemi. Manufactured with precision and quality in mind, this product offers unparalleled reliability and performance. Ideal for a wide range of applications, this logic gate is a game-changer in the industry. With its compact design and advanced technology, customers can expect seamless integration and superior functionality. Experience the value and benefits that this product brings to your projects, and elevate your performance to new heights with Onsemi's NLV74VHC32DR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into circuit boards, saving space and making assembly more efficient.

No. of Functions: 4

With 4 functions in one package, this product offers versatility and cost-effectiveness by providing multiple gates in one component.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and alignment on circuit boards, simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V, this product is compatible with a wide range of systems and power sources.

Propagation Delay (tpd): 13 ns

With a fast propagation delay of 13 ns, this product enables high-speed operation in digital circuits.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C makes this product suitable for use in demanding environments and automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable performance even in harsh cold conditions.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and compatibility with various logic families.

Technical Specifications

Logic Gates NLV74VHC32DR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

13 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV74VHC32DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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