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NLV74LCX373DTR2G

Onsemi

NLV74LCX373DTR2G by Onsemi

NLV74LCX373DTR2G by Onsemi is an 8-bit bus driver with 3-STATE output, operating at a supply voltage range of 2V to 3.6V. It features a propagation delay of 10.5ns and can handle load capacitance up to 50pF. Ideal for industrial applications requiring fast signal transmission in compact spaces due to its small outline package style.

Median Price

$0.406

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,414 parts In-Stock

1+ parts

-

100+ parts

$0.399

1k+ parts

$0.331

10k+ parts

$0.295

14,414

-

$0.399

$0.331

$0.295

Verical

USA . 7,400 parts In-Stock

1+ parts

-

100+ parts

-

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$0.414

10k+ parts

$0.369

7,400

-

-

$0.414

$0.369

Distributors (In-Stock)

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Digiode

USA . 1,236 parts In-Stock

1+ parts

$0.311

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1,236

$0.311

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Vyrian

USA . 5,768 parts In-Stock

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5,768

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ComSIT Distribution GmbH

Germany . 1,981 parts In-Stock

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1,981

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Distributors (Availability)

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Corphita

USA . 632 parts In-Stock

1+ parts

$0.294

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-

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632

$0.294

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Vigor

Singapore . 478 parts In-Stock

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$0.310

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478

$0.310

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Corohmni

South Africa . 190 parts In-Stock

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$0.327

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190

$0.327

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Microchip USA

USA . 5,362 parts In-Stock

1+ parts

$2.353

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5,362

$2.353

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AZTECH Wire

Italy . 60 parts In-Stock

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$20.420

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60

$20.420

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$31.477

100+ parts

$28.644

1k+ parts

$25.811

10k+ parts

-

60

$31.477

$28.644

$25.811

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Continental Prestige Electronics

USA . 14,414 parts In-Stock

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$0.390

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14,414

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$0.390

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Kulean Microsystems

USA . 8,327 parts In-Stock

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8,327

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SupplyDigital Components

Austria . 6,623 parts In-Stock

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Problanco Electronics

Mexico . 4,658 parts In-Stock

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4,658

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TANS Electronics

Latvia . 1,761 parts In-Stock

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1,761

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 145 parts In-Stock

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145

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Overview

Enhance your electronics projects with the NLV74LCX373DTR2G by Onsemi. Crafted with precision and expertise, this bus driver & transceiver offers seamless performance and reliability. Perfect for a wide range of applications, this product ensures fast propagation delay and 3-state output characteristics. With a small outline package style and industrial temperature grade, this component is designed to exceed expectations. Experience the value and benefits of Onsemi's superior technology and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver and transceiver, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 8 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a low supply voltage of 2.5V minimizes power consumption, making this product energy-efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product reliable and efficient in data transmission.

Technical Specifications

Bus Driver & Transceivers NLV74LCX373DTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74LCX373DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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