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NLV74HCT574ADWRG

Onsemi

NLV74HCT574ADWRG by Onsemi

NLV74HCT574ADWRG by Onsemi is an 8-bit bus driver with 3-STATE output. It operates at a supply voltage range of 4.5V to 5.5V, offering a propagation delay of 45ns. This CMOS technology component is ideal for military-grade applications requiring reliable data transmission in small outline packages.

Median Price

$0.356

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 102,886 parts In-Stock

1+ parts

-

100+ parts

$0.356

1k+ parts

$0.295

10k+ parts

$0.263

102,886

-

$0.356

$0.295

$0.263

Verical

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.400

10k+ parts

$0.329

30,000

-

-

$0.400

$0.329

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.315

10k+ parts

$0.287

1,000

-

-

$0.315

$0.287

Distributors (In-Stock)

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Digiode

USA . 2,093 parts In-Stock

1+ parts

$0.277

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2,093

$0.277

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Vyrian

USA . 4,132 parts In-Stock

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4,132

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ACDS - Activité Composants Distribution Service

France . 2,000 parts In-Stock

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2,000

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Bristol Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.450

1k+ parts

$0.194

10k+ parts

$0.180

2,000

-

$0.450

$0.194

$0.180

Dan-Mar Components

USA . 2,000 parts In-Stock

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2,000

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Distributors (Availability)

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Corphita

USA . 877 parts In-Stock

1+ parts

$0.263

100+ parts

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877

$0.263

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Vigor

Singapore . 585 parts In-Stock

1+ parts

$0.290

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585

$0.290

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Corohmni

South Africa . 181 parts In-Stock

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$0.292

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181

$0.292

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Microchip USA

USA . 2,479 parts In-Stock

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$2.315

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2,479

$2.315

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Advanced Electronics

New Zealand . 95 parts In-Stock

1+ parts

$28.217

100+ parts

$25.677

1k+ parts

$23.138

10k+ parts

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95

$28.217

$25.677

$23.138

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Continental Prestige Electronics

USA . 102,886 parts In-Stock

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$0.370

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102,886

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$0.370

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Kulean Microsystems

USA . 7,623 parts In-Stock

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7,623

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Problanco Electronics

Mexico . 7,609 parts In-Stock

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SupplyDigital Components

Austria . 7,270 parts In-Stock

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7,270

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UHIMA Technologies

Türkiye . 360 parts In-Stock

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360

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TANS Electronics

Latvia . 154 parts In-Stock

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154

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Overview

Unlock the power of seamless data transmission with the NLV74HCT574ADWRG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products, making them a trusted choice for bus driver & transceiver solutions. Ideal for a wide range of applications, this 8-bit driver offers customers the advantage of fast propagation delay, true output polarity, and a compact package design. Trust Onsemi to provide you with a high-performance solution that adds value to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver and transceiver, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during manufacturing processes.

No. of Bits: 8

Offers a sufficient number of bits for data transmission and reception, suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage, ensuring compatibility with most systems and devices.

Propagation Delay (tpd): 45 ns

Provides fast signal processing and transmission, improving the overall efficiency of data transfer.

Output Characteristics: 3-STATE

Allows for high impedance output when disabled, preventing signal interference and improving signal integrity.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it an energy-efficient and reliable choice.

Technical Specifications

Bus Driver & Transceivers NLV74HCT574ADWRG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

45 ns

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

NLV74HCT574ADWRG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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