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NLV74HCT541ADTRG

Onsemi

NLV74HCT541ADTRG by Onsemi

NLV74HCT541ADTRG by Onsemi is an 8-bit bus driver with 32ns propagation delay at 5V. It features a small outline package and operates in the temperature range of -55 to 125 °C. Ideal for military applications requiring true output polarity and positive edge trigger control.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Flip Electronics

USA . 25,000 parts In-Stock

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Vyrian

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Digiode

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Vigor

Singapore . 497 parts In-Stock

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Microchip USA

USA . 4,307 parts In-Stock

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AZTECH Wire

Italy . 1,068 parts In-Stock

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SupplyDigital Components

Austria . 6,606 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

Mexico . 4,272 parts In-Stock

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TANS Electronics

Latvia . 2,720 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 926 parts In-Stock

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Overview

Enhance your electronics projects with the NLV74HCT541ADTRG by Onsemi, a high-quality bus driver and transceiver that offers superior performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is ideal for a wide range of applications. With its advanced features and innovative design, this component provides exceptional value to customers, delivering benefits such as fast propagation delay, low power consumption, and precise output characteristics. Upgrade your projects today with the NLV74HCT541ADTRG and experience the advantages of using top-notch components from a reputable manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the transceiver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 32 ns

Fast propagation delay ensures efficient data transmission, making this transceiver suitable for high-speed applications.

Surface Mount: YES

Allows for easy and secure mounting on a PCB, saving space and simplifying the assembly process.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability, ensuring that the transceiver can withstand harsh operating conditions.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with a wide range of systems.

Output Polarity: TRUE

Provides a clear signal output, reducing the chances of signal interference or misinterpretation.

Maximum Operating Temperature: 125 °C

Can function reliably in high-temperature environments, making it suitable for automotive and industrial applications.

Technical Specifications

Bus Driver & Transceivers NLV74HCT541ADTRG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

32 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

NLV74HCT541ADTRG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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