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NLU1G86MUTCG

Onsemi

NLU1G86MUTCG by Onsemi

NLU1G86MUTCG by Onsemi is a CMOS Logic Gate with 2 inputs, 19.5 ns propagation delay, and 50 pF load capacitance. Ideal for military applications due to its small outline package style and wide operating temperature range from -55 °C to 125°C. Suitable for surface mount assembly with a max supply voltage of 5.5 V.

Median Price

$0.216

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 312,040 parts In-Stock

1+ parts

-

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$0.225

1k+ parts

$0.186

10k+ parts

$0.166

312,040

-

$0.225

$0.186

$0.166

Verical

USA . 153,000 parts In-Stock

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$0.208

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$0.208

Distributors (In-Stock)

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Digiode

USA . 469 parts In-Stock

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$0.175

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469

$0.175

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Bristol Electronics

USA . 2,990 parts In-Stock

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2,990

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Dan-Mar Components

USA . 2,990 parts In-Stock

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2,990

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Vyrian

USA . 2,389 parts In-Stock

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2,389

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Distributors (Availability)

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Corphita

USA . 281 parts In-Stock

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$0.166

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$0.166

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Vigor

Singapore . 789 parts In-Stock

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$0.180

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789

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Corohmni

South Africa . 326 parts In-Stock

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$0.184

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326

$0.184

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Component Stockers USA

USA . 455,371 parts In-Stock

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$0.190

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$0.180

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$0.160

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$0.160

455,371

$0.190

$0.180

$0.160

$0.160

AZTECH Wire

Italy . 285 parts In-Stock

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$21.320

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285

$21.320

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Continental Prestige Electronics

USA . 312,040 parts In-Stock

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$0.140

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312,040

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QUARKTWIN TECHNOLOGY LTD

USA . 13,678 parts In-Stock

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Microchip USA

USA . 6,927 parts In-Stock

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Kulean Microsystems

USA . 4,701 parts In-Stock

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SupplyDigital Components

Austria . 2,916 parts In-Stock

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Problanco Electronics

Mexico . 2,478 parts In-Stock

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UHIMA Technologies

Türkiye . 667 parts In-Stock

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TANS Electronics

Latvia . 235 parts In-Stock

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Overview

Unlock the power of seamless logic with the NLU1G86MUTCG by Onsemi. Crafted with precision and expertise, this Logic Gates component offers unmatched reliability and performance. Ideal for a wide range of applications, this product ensures smooth operation and enhanced efficiency. Experience the value of superior quality and cutting-edge technology with the NLU1G86MUTCG, bringing innovation to your projects and delivering exceptional results. Elevate your work with the best in the industry, choose Onsemi for unparalleled excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, which is ideal for portable electronic devices.

Propagation Delay At Nominal Supply: 19.5 ns

The low propagation delay ensures fast operation and high speed performance of the logic gates.

Surface Mount: YES

Being surface mountable allows for easy assembly and saves space on the circuit board.

Nominal Supply Voltage: 5 V

The 5V supply voltage is a commonly used standard in many electronic circuits, making integration easier.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Technical Specifications

Logic Gates NLU1G86MUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

19.5 ns

Propagation Delay (tpd):

19.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NLU1G86MUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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