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NLU1G32MUTCG

Onsemi

NLU1G32MUTCG by Onsemi

NLU1G32MUTCG by Onsemi is a CMOS Logic Gate with 2 inputs, 15.5 ns propagation delay, and 50 pF load capacitance. It operates b/w -55 to 125 °C and has a supply voltage range of 1.65V to 5.5V. Ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$0.807

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 4,565 parts In-Stock

1+ parts

$1.470

100+ parts

$0.422

1k+ parts

$0.329

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4,565

$1.470

$0.422

$0.329

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Rochester

USA . 275 parts In-Stock

1+ parts

-

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$0.144

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$0.119

10k+ parts

$0.106

275

-

$0.144

$0.119

$0.106

Distributors (In-Stock)

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Digiode

USA . 2,119 parts In-Stock

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$0.112

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$0.112

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Cyclops Electronics Ltd

UK . 16,205 parts In-Stock

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Flip Electronics

USA . 6,000 parts In-Stock

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Vyrian

USA . 4,952 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

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Bristol Electronics

USA . 3,000 parts In-Stock

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Dan-Mar Components

USA . 3,000 parts In-Stock

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Corphita

USA . 2,089 parts In-Stock

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$0.106

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$0.106

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Corohmni

South Africa . 109 parts In-Stock

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$0.118

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AZTECH Wire

Italy . 1,170 parts In-Stock

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$11.760

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$11.760

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$20.800

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$18.928

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$17.056

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$20.800

$18.928

$17.056

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Perfect Parts

USA . 33,780 parts In-Stock

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Kepictronics

USA . 21,000 parts In-Stock

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Microchip USA

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TANS Electronics

Latvia . 8,156 parts In-Stock

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Problanco Electronics

Mexico . 7,985 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 5,785 parts In-Stock

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SupplyDigital Components

Austria . 5,250 parts In-Stock

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Assy Fe

Spain . 2,955 parts In-Stock

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Kulean Microsystems

USA . 1,713 parts In-Stock

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Futuretech Components

Singapore . 542 parts In-Stock

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UHIMA Technologies

Türkiye . 363 parts In-Stock

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Overview

Unlock the power of precision with the NLU1G32MUTCG Logic Gate by Onsemi. This cutting-edge component offers lightning-fast propagation delay and a compact design perfect for space-constrained applications. Trust in Onsemi's reputation for top-quality manufacturing to deliver reliable performance every time. Whether you're designing industrial control systems or consumer electronics, this logic gate provides the speed and efficiency you need to bring your projects to life. Experience the value and benefits of choosing Onsemi for all your semiconductor needs.

Feature Benefit Bullets

Propagation Delay At Nominal Supply 15.5 ns

Low propagation delay ensures fast response time.

Surface Mount YES

Ease of installation and space-saving design.

No. of Inputs 2

Suitable for basic logic operations.

Nominal Supply Voltage / Vsup (V) 3

Compatible with common power supply voltages.

Load Capacitance (CL) 50 pF

Can drive a moderate amount of load capacitance.

Power Supplies (V) 1.8/5

Supports multiple power supply options.

No. of Terminals 6

Simplified interfacing and connections.

Package Style (Meter) SMALL OUTLINE, VERY THIN PROFILE

Compact and space-efficient design.

Maximum I (ol) 4 Amp

Can handle high output currents.

Maximum Operating Temperature 125 °C

Suitable for a wide range of operating environments.

Minimum Operating Temperature -55 °C

Can operate in extreme low-temperature conditions.

Terminal Finish NICKEL PALLADIUM GOLD

Provides good corrosion resistance and conductivity.

Width 1 mm

Compact form factor.

Maximum Supply Voltage (Vsup) 5.5 V

High input voltage tolerance.

Technology CMOS

Low power consumption and high noise immunity.

Terminal Form NO LEAD

Environmentally friendly.

Temperature Grade MILITARY

Meets stringent military standards for reliability.

Packing Method TR

Suitable for tape and reel automated assembly processes.

Terminal Pitch 0.4 mm

Fine pitch for compact layout.

Maximum Time At Peak Reflow Temperature (s) 30

Allows for reliable soldering during assembly.

Peak Reflow Temperature °C 260

Capable of withstanding high-temperature soldering processes.

Technical Specifications

Logic Gates NLU1G32MUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

15.5 ns

Propagation Delay (tpd):

15.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NLU1G32MUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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