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NL27WZ86USG

Onsemi

NL27WZ86USG by Onsemi

NL27WZ86USG by Onsemi is a Logic Gates IC with 2 functions and inputs. It has a propagation delay of 5.9 ns at 3.3V, suitable for automotive applications due to its CMOS technology and operating temperature range of -40 to 125 °C.

Median Price

$0.220

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 22,613 parts In-Stock

1+ parts

$0.220

100+ parts

$0.115

1k+ parts

$0.096

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22,613

$0.220

$0.115

$0.096

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Mouser Electronics

USA . 5,386 parts In-Stock

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$0.220

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$0.116

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$0.096

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$0.087

5,386

$0.220

$0.116

$0.096

$0.087

Flip Electronics (Authorized)

USA . 69,000 parts In-Stock

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EBV Elektronik

Germany . 9,000 parts In-Stock

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Farnell

UK . 3,000 parts In-Stock

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$0.074

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$0.061

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Rochester

USA . 3,000 parts In-Stock

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Chip Stock

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IBS Electronics

USA . 12,000 parts In-Stock

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$0.073

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$0.073

NAC Semi

USA . 6,000 parts In-Stock

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$0.097

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$0.097

ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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Rebound Electronics

UK . 2,649 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 2,262 parts In-Stock

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Digiode

USA . 1,638 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,450 parts In-Stock

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Vyrian

USA . 1,124 parts In-Stock

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Electronic Treasures

USA . 86 parts In-Stock

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NPI Materials, Inc.

USA . 25 parts In-Stock

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Sensible Micro Corp

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Vigor

Singapore . 228 parts In-Stock

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$0.480

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228

$0.480

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Component Stockers USA

USA . 23,362 parts In-Stock

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$2.100

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AZTECH Wire

Italy . 1,124 parts In-Stock

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$15.150

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Ampacity Inc.

Singapore . 35,580 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Lixinc

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TANS Electronics

Latvia . 6,341 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,781 parts In-Stock

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Microchip USA

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SupplyDigital Components

Austria . 5,162 parts In-Stock

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Metaverse IC Inc.

Canada . 2,997 parts In-Stock

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Kulean Microsystems

USA . 2,253 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,450 parts In-Stock

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Glotronic Ltd.

UK . 1,160 parts In-Stock

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Corphita

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Corohmni

South Africa . 278 parts In-Stock

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Problanco Electronics

Mexico . 100 parts In-Stock

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UHIMA Technologies

Türkiye . 91 parts In-Stock

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Overview

Discover the innovative NL27WZ86USG by Onsemi, a top-quality logic gate designed to enhance your electronic projects. Manufactured by industry leader Onsemi, this product offers fast propagation delays and low power consumption, making it ideal for automotive applications. With a compact design and high reliability, this logic gate provides exceptional value and performance for your projects. Upgrade your designs with the NL27WZ86USG and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protects the internal components of the logic gates.

Propagation Delay At Nominal Supply: 5.9 ns

The low propagation delay at nominal supply voltage ensures fast operation of the logic gates, making them suitable for time-sensitive applications.

Surface Mount: YES

Being surface mountable, these logic gates are easy to install on circuit boards, saving space and enabling high-density circuit designs.

Nominal Supply Voltage / Vsup (V): 2.3

The low nominal supply voltage requirement of 2.3V makes these logic gates energy-efficient and compatible with a wide range of power sources.

Technology: CMOS

Utilizing CMOS technology, these logic gates offer low power consumption, high noise immunity, and fast switching speeds, making them reliable components for various digital circuits.

Technical Specifications

Logic Gates NL27WZ86USG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

27WZ

JESD-30 Code:

R-PDSO-G8

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL SILVER GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NL27WZ86USG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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