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NL17SZ332DBVT1G

Onsemi

NL17SZ332DBVT1G by Onsemi

NL17SZ332DBVT1G by Onsemi is a CMOS Logic Gate with 3 inputs, 6ns propagation delay at 3.3V supply voltage. Ideal for military-grade applications due to its small outline package and wide operating temperature range of -55 °C to 125°C.

Median Price

$0.093

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 9,996 parts In-Stock

1+ parts

$0.140

100+ parts

$0.067

1k+ parts

$0.054

10k+ parts

$0.052

9,996

$0.140

$0.067

$0.054

$0.052

Flip Electronics (Authorized)

USA . 183,000 parts In-Stock

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Rochester

USA . 29,800 parts In-Stock

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$0.046

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$0.038

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$0.034

29,800

-

$0.046

$0.038

$0.034

Distributors (In-Stock)

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Digiode

USA . 1,519 parts In-Stock

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$0.036

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Flip Electronics

USA . 177,000 parts In-Stock

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Vyrian

USA . 8,445 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,089 parts In-Stock

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$0.034

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Corohmni

South Africa . 102 parts In-Stock

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$0.038

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102

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AZTECH Wire

Italy . 485 parts In-Stock

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$16.230

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Kulean Microsystems

USA . 5,725 parts In-Stock

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Problanco Electronics

Mexico . 2,787 parts In-Stock

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SupplyDigital Components

Austria . 950 parts In-Stock

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UHIMA Technologies

Türkiye . 836 parts In-Stock

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TANS Electronics

Latvia . 830 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic projects with the NL17SZ332DBVT1G logic gate by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge technology to meet all your needs. This versatile logic gate is perfect for a wide range of applications in the electronics industry, offering high performance and efficiency. With fast propagation delay and low power consumption, this product ensures seamless operation and optimal functionality. Upgrade your projects with the NL17SZ332DBVT1G and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay allows for faster operation and better performance in time-critical applications.

No. of Inputs: 3

Having multiple inputs allows for more complex logic operations to be performed by the gate.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with commonly used supply voltages, making it easy to integrate into existing systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for a wide range of applications.

Technical Specifications

Logic Gates NL17SZ332DBVT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

19 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

NL17SZ332DBVT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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