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NL17SZ32XV5T2

Onsemi

NL17SZ32XV5T2 by Onsemi

NL17SZ32XV5T2 by Onsemi is a CMOS Logic Gate with 2 inputs, 5.5 ns propagation delay at 1.8V supply, and 12.7 ns propagation delay. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package for surface mount applications.

Median Price

$0.064

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 95,642 parts In-Stock

1+ parts

-

100+ parts

$0.066

1k+ parts

$0.055

10k+ parts

$0.049

95,642

-

$0.066

$0.055

$0.049

Verical

USA . 93,900 parts In-Stock

1+ parts

-

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$0.061

93,900

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$0.061

Distributors (In-Stock)

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Digiode

USA . 2,496 parts In-Stock

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$0.051

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2,496

$0.051

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ACDS - Activité Composants Distribution Service

France . 3,700 parts In-Stock

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3,700

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Vyrian

USA . 3,650 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,510 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,440 parts In-Stock

1+ parts

$0.049

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$0.049

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Vigor

Singapore . 146 parts In-Stock

1+ parts

$0.050

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146

$0.050

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Corohmni

South Africa . 442 parts In-Stock

1+ parts

$0.054

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442

$0.054

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AZTECH Wire

Italy . 194 parts In-Stock

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$13.420

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194

$13.420

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GreenTree Electronics

Israel . 98,000 parts In-Stock

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Continental Prestige Electronics

USA . 95,642 parts In-Stock

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$0.047

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95,642

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$0.047

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Perfect Parts

USA . 8,288 parts In-Stock

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8,288

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SupplyDigital Components

Austria . 8,108 parts In-Stock

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TANS Electronics

Latvia . 6,409 parts In-Stock

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Kepictronics

USA . 4,613 parts In-Stock

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4,613

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Problanco Electronics

Mexico . 4,221 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 3,700 parts In-Stock

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Assy Fe

Spain . 3,464 parts In-Stock

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Glotronic Ltd.

UK . 2,960 parts In-Stock

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Kulean Microsystems

USA . 2,340 parts In-Stock

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Microchip USA

USA . 386 parts In-Stock

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UHIMA Technologies

Türkiye . 126 parts In-Stock

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Overview

Enhance your electronic projects with the NL17SZ32XV5T2 logic gate by Onsemi. Known for their high-quality components, Onsemi brings you a reliable and efficient solution for your circuit design needs. This small outline, very thin profile package offers fast propagation delay and low power consumption, making it ideal for applications requiring quick response times and minimal energy usage. Upgrade your designs with the NL17SZ32XV5T2 and experience the benefits of superior performance and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC and EPOXY materials provide durability and protection for the components inside, making the product long-lasting.

Propagation Delay At Nominal Supply: 5.5 ns

Low propagation delay ensures fast signal processing, making the product suitable for applications where speed is crucial.

No. of Inputs: 2

With 2 inputs, this logic gate can perform basic logical operations effectively, making it versatile for various circuit designs.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V, this logic gate offers energy efficiency and can be used in battery-operated devices.

Power Supplies (V): 3.3

Supporting a power supply voltage of 3.3V, this logic gate is compatible with common voltage levels in electronic systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this logic gate can withstand elevated temperatures, ensuring reliability in adverse conditions.

Technology: CMOS

CMOS technology is known for low power consumption and high noise immunity, making this logic gate efficient and reliable in digital circuits.

Technical Specifications

Logic Gates NL17SZ32XV5T2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SZ

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

1.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

12.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.6 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.2 mm

Trade Compliance

NL17SZ32XV5T2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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