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NL17SZ32EDFT2G

Onsemi

NL17SZ32EDFT2G by Onsemi

NL17SZ32EDFT2G by Onsemi is a CMOS Logic Gate with 5.5 ns Propagation Delay, suitable for automotive applications. It operates at temperatures ranging from -40 to 125 °C and has a max supply voltage of 5.5 V, making it ideal for surface mount designs with a load capacitance of 50 pF.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,049 parts In-Stock

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Digiode

USA . 1,797 parts In-Stock

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AZTECH Wire

Italy . 662 parts In-Stock

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$14.320

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SupplyDigital Components

Austria . 6,614 parts In-Stock

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TANS Electronics

Latvia . 6,228 parts In-Stock

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Kulean Microsystems

USA . 5,449 parts In-Stock

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Corphita

USA . 2,480 parts In-Stock

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Problanco Electronics

Mexico . 845 parts In-Stock

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Corohmni

South Africa . 378 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 112 parts In-Stock

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Overview

Experience the superior quality and reliability of Onsemi's NL17SZ32EDFT2G Logic Gates! With a sleek small outline package and fast propagation delay, this component is ideal for automotive applications. Benefit from its low power consumption and high performance, making it a valuable addition to your projects. Trust in Onsemi's expertise in semiconductor manufacturing to provide you with the best-in-class products. Explore endless possibilities with the NL17SZ32EDFT2G and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring the product's longevity.

Propagation Delay At Nominal Supply: 5.5 ns

With a low propagation delay, this product ensures fast signal processing, making it suitable for applications requiring quick response times.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB, making it ideal for compact electronic designs.

No. of Inputs: 2

Having 2 inputs allows for versatile logic operations, making this product suitable for various logic gate applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with many electronic systems and easy to integrate into existing setups.

Load Capacitance (CL): 50 pF

The low load capacitance ensures efficient signal transmission and minimal interference, resulting in reliable performance.

No. of Terminals: 5

Having 5 terminals simplifies the connection process and allows for easy integration into circuit designs.

Maximum I (ol): 24 Amp

With a high output current capacity, this product can drive heavy loads without overheating or damaging the circuit.

Propagation Delay (tpd): 12.7 ns

The moderate propagation delay ensures a balance between speed and power consumption, making this product suitable for various applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in extreme cold conditions, making this product versatile and durable.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and ensures reliable electrical connections, enhancing the product's durability.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in PCB layout, accommodating different design requirements and simplifying installation.

Maximum Seated Height: 1.1 mm

The low seated height saves space on the PCB and allows for compact electronic designs, making this product ideal for applications with size constraints.

Width: 1.25 mm

The narrow width saves space on the PCB and allows for densely packed circuit designs, optimizing the use of available board space.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage allows for operation in low-power applications, making this product energy-efficient and suitable for battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 30

The extended time at peak reflow temperature allows for reliable soldering and ensures proper bonding, reducing the risk of solder joint failure.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can withstand the soldering process without damage, ensuring robust assembly and long-term reliability.

Length: 2 mm

The compact length saves space on the PCB and allows for flexible circuit layout, making this product suitable for applications with size constraints.

Temperature Grade: AUTOMOTIVE

Being automotive-grade, this product meets stringent quality and reliability standards, making it suitable for automotive electronics and other high-performance applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliable solder connections, ensuring robust performance in harsh operating conditions.

Packing Method: TR

The TR packing method ensures safe transportation and storage of the product, protecting it from damage and ensuring quality upon arrival.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high-density mounting and space-saving PCB layouts, making this product suitable for compact electronic designs.

Maximum Supply Voltage (Vsup): 5.5 V

With a high maximum supply voltage, this product can handle voltage spikes and surges without damage, ensuring reliable operation in demanding conditions.

Maximum Power Supply Current (ICC): 0.01 mA

With a low maximum power supply current, this product consumes minimal energy, making it ideal for low-power and battery-operated devices.

Technical Specifications

Logic Gates NL17SZ32EDFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

12.7 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NL17SZ32EDFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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