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NL17SZ32DBVT1G

Onsemi

NL17SZ32DBVT1G by Onsemi

NL17SZ32DBVT1G by Onsemi is a CMOS Logic Gate with 2 inputs, 5 terminals, and 12.7 ns propagation delay. Operating temperature range from -55 to 125 °C makes it suitable for military applications. With a small outline package style and matte tin finish, it's ideal for surface mount designs.

Median Price

$0.066

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 192,000 parts In-Stock

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Rochester

USA . 21,000 parts In-Stock

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$0.068

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$0.056

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$0.050

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$0.068

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$0.050

Verical

USA . 21,000 parts In-Stock

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$0.063

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$0.063

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Digiode

USA . 764 parts In-Stock

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$0.027

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NAC Semi

USA . 153,000 parts In-Stock

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$0.072

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Flip Electronics

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Vyrian

USA . 6,956 parts In-Stock

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Corphita

USA . 160 parts In-Stock

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$0.025

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Corohmni

South Africa . 487 parts In-Stock

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$0.038

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Andel Nordic

Denmark . 2,340 parts In-Stock

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$1.840

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$1.286

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$1.286

2,340

$1.840

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$1.286

AZTECH Wire

Italy . 733 parts In-Stock

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$10.910

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Lixinc

USA . 15,221 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 6,310 parts In-Stock

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Problanco Electronics

Mexico . 2,176 parts In-Stock

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TANS Electronics

Latvia . 1,950 parts In-Stock

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Kulean Microsystems

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Microchip USA

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UHIMA Technologies

Türkiye . 236 parts In-Stock

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Overview

Discover the innovative NL17SZ32DBVT1G by Onsemi, a top-tier manufacturer known for delivering high-quality logic gates. Ideal for various applications, this product offers unmatched reliability and performance. With a compact package and low power consumption, customers can trust in its efficiency and seamless operation. Enhance your projects with this advanced technology and experience the value it brings to your designs. Trust in Onsemi for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

No. of Inputs: 2

Having 2 inputs allows for more flexibility in creating logic operations, making this product suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 2.3

The nominal supply voltage of 2.3V ensures efficient power consumption and compatibility with common power sources.

Propagation Delay (tpd): 12.7 ns

With a low propagation delay of 12.7 ns, this logic gate delivers fast signal processing and response times.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C makes this product suitable for use in a wide range of environmental conditions.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide range of systems.

Technical Specifications

Logic Gates NL17SZ32DBVT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay (tpd):

12.7 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

NL17SZ32DBVT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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