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NL17SZ08XV5T2

Onsemi

NL17SZ08XV5T2 by Onsemi

NL17SZ08XV5T2 by Onsemi is a CMOS Logic Gate with 2 inputs, 5.5 ns propagation delay, and 1.8V nominal voltage. Ideal for industrial applications requiring fast signal processing in a small outline package with very thin profile design. Suitable for surface mount assembly with a max operating temperature of 85°C.

Median Price

$0.066

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,990 parts In-Stock

1+ parts

-

100+ parts

$0.066

1k+ parts

$0.055

10k+ parts

$0.049

4,990

-

$0.066

$0.055

$0.049

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$0.048

100+ parts

-

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650

$0.048

-

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Digiode

USA . 1,109 parts In-Stock

1+ parts

$0.051

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1,109

$0.051

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Vyrian

USA . 8,468 parts In-Stock

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8,468

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Cyclops Electronics Ltd

UK . 4,980 parts In-Stock

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4,980

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Distributors (Availability)

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Semicontronic

India . 4,960 parts In-Stock

1+ parts

$0.046

100+ parts

$0.045

1k+ parts

$0.045

10k+ parts

-

4,960

$0.046

$0.045

$0.045

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Ampacity Inc.

Singapore . 4,525 parts In-Stock

1+ parts

$0.046

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-

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4,525

$0.046

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Continental Prestige Electronics

USA . 3,781 parts In-Stock

1+ parts

$0.048

100+ parts

-

1k+ parts

-

10k+ parts

$0.047

3,781

$0.048

-

-

$0.047

Argo Parts USA

USA . 2,460 parts In-Stock

1+ parts

$0.048

100+ parts

-

1k+ parts

-

10k+ parts

$0.047

2,460

$0.048

-

-

$0.047

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.048

100+ parts

-

1k+ parts

$0.046

10k+ parts

$0.045

2,000

$0.048

-

$0.046

$0.045

Corphita

USA . 410 parts In-Stock

1+ parts

$0.049

100+ parts

-

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410

$0.049

-

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Vigor

Singapore . 353 parts In-Stock

1+ parts

$0.050

100+ parts

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353

$0.050

-

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Corohmni

South Africa . 68 parts In-Stock

1+ parts

$0.054

100+ parts

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68

$0.054

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Aztec Data Supply Inc.

USA . 421 parts In-Stock

1+ parts

$9.680

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421

$9.680

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AZTECH Wire

Italy . 343 parts In-Stock

1+ parts

$19.180

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343

$19.180

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Assy Fe

Spain . 9,200 parts In-Stock

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9,200

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SupplyDigital Components

Austria . 6,657 parts In-Stock

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6,657

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kepictronics

USA . 4,500 parts In-Stock

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4,500

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 2,544 parts In-Stock

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2,544

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Kulean Microsystems

USA . 2,404 parts In-Stock

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Problanco Electronics

Mexico . 1,063 parts In-Stock

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GreenTree Electronics

Israel . 494 parts In-Stock

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494

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Microchip USA

USA . 282 parts In-Stock

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UHIMA Technologies

Türkiye . 78 parts In-Stock

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78

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Overview

Enhance your electronic projects with the NL17SZ08XV5T2 logic gate from Onsemi. Crafted with precision and expertise, this small outline, very thin profile package offers a speedy propagation delay of 5.5 ns, making it ideal for applications requiring quick response times. With a low supply voltage of 1.8 V and a maximum operating temperature of 85°C, this logic gate provides reliable performance in industrial settings. Elevate your designs with the quality and efficiency of Onsemi's NL17SZ08XV5T2 logic gate today!

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Propagation Delay At Nominal Supply

5.5 ns - With a low propagation delay, this logic gate allows for fast signal processing in electronic circuits.

Surface Mount

YES - Being surface mountable makes installation and maintenance of this logic gate convenient and space-saving.

No. of Inputs

2 - With two inputs, this logic gate is versatile for implementing different logic functions in electronic systems.

Package Shape

RECTANGULAR - The rectangular package shape offers easy PCB layout integration for seamless circuit design.

Nominal Supply Voltage / Vsup (V)

1.8 - Operating at a low nominal supply voltage of 1.8V ensures energy efficiency and compatibility with a wide range of systems.

Load Capacitance (CL)

50 pF - This logic gate can drive a load capacitance of 50pF, making it suitable for various applications requiring different capacitive loads.

Power Supplies (V)

3.3 - Supporting power supplies of 3.3V enables compatibility with standard voltage levels in electronic systems.

Package Style (Meter)

SMALL OUTLINE, VERY THIN PROFILE - The small outline and thin profile of the package make it ideal for designs where space is a constraint.

Maximum I (ol)

24 Amp - With a high maximum output current of 24A, this logic gate can drive heavy loads with ease.

Propagation Delay (tpd)

12.7 ns - The propagation delay of 12.7ns ensures quick response times, making it suitable for high-speed applications.

Maximum Operating Temperature

85 °C - With a maximum operating temperature of 85°C, this logic gate can withstand elevated temperatures without performance degradation.

Minimum Operating Temperature

40 °C - Operating at a minimum temperature of -40°C allows for reliable performance in extreme cold conditions.

Terminal Finish

TIN - The terminal finish of TIN provides corrosion resistance and ensures secure electrical connections.

Terminal Position

DUAL - Dual terminal positions offer flexibility in mounting and connecting the logic gate in different configurations.

Maximum Seated Height

0.6 mm - The low seated height of 0.6mm saves space and allows for compact PCB designs.

Width

1.2 mm - With a width of 1.2mm, this logic gate is suitable for applications where board space is limited.

Minimum Supply Voltage (Vsup)

1.65 V - Operating at a minimum supply voltage of 1.65V ensures compatibility with low-voltage systems.

Peak Reflow Temperature °C

260 - With a peak reflow temperature of 260°C, the logic gate can withstand high-temperature soldering processes.

Length

1.6 mm - The length of 1.6mm makes this logic gate suitable for compact designs where size is a critical factor.

Temperature Grade

INDUSTRIAL - Designed for industrial temperature ranges, this logic gate is suitable for rugged and demanding environments.

Technology

CMOS - Using CMOS technology ensures low power consumption and high noise immunity in digital circuits.

Terminal Form

FLAT - The flat terminal form simplifies soldering and ensures a secure connection in a variety of applications.

Packing Method

TR - The tape and reel (TR) packaging method enables automated assembly processes for efficient production.

Terminal Pitch

0.5 mm - With a terminal pitch of 0.5mm, this logic gate is compatible with standard PCB technologies for easy integration.

Maximum Supply Voltage (Vsup)

5.5 V - Supporting a maximum supply voltage of 5.5V allows for compatibility with a wide range of power sources and systems.

Technical Specifications

Logic Gates NL17SZ08XV5T2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

1.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

12.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.6 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.2 mm

Trade Compliance

NL17SZ08XV5T2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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