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NL17SG17DFT2G

Onsemi

NL17SG17DFT2G by Onsemi

NL17SG17DFT2G by Onsemi is a CMOS Logic Gate with 58.1ns Propagation Delay, operating b/w -55 to 125°C. With a supply voltage range of 0.9V to 3.6V, it's ideal for military-grade applications requiring fast signal processing in compact spaces due to its small outline and thin profile package style.

Median Price

$0.047

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 556 parts In-Stock

1+ parts

$0.440

100+ parts

$0.164

1k+ parts

$0.123

10k+ parts

-

556

$0.440

$0.164

$0.123

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Rochester

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

$0.047

1k+ parts

$0.039

10k+ parts

$0.035

21,000

-

$0.047

$0.039

$0.035

Verical

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.044

21,000

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-

-

$0.044

Distributors (In-Stock)

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Digiode

USA . 1,499 parts In-Stock

1+ parts

$0.418

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1,499

$0.418

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Vyrian

USA . 4,997 parts In-Stock

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4,997

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Flip Electronics

USA . 2,520 parts In-Stock

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2,520

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Distributors (Availability)

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Ampacity Inc.

Singapore . 316 parts In-Stock

1+ parts

$0.374

100+ parts

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316

$0.374

-

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Corphita

USA . 2,084 parts In-Stock

1+ parts

$0.396

100+ parts

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2,084

$0.396

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Vigor

Singapore . 456 parts In-Stock

1+ parts

$0.410

100+ parts

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456

$0.410

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Component Stockers USA

USA . 3,870 parts In-Stock

1+ parts

$0.420

100+ parts

$0.160

1k+ parts

$0.090

10k+ parts

-

3,870

$0.420

$0.160

$0.090

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Corohmni

South Africa . 342 parts In-Stock

1+ parts

$0.440

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342

$0.440

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Microchip USA

USA . 242 parts In-Stock

1+ parts

$0.480

100+ parts

$0.480

1k+ parts

$0.480

10k+ parts

$0.470

242

$0.480

$0.480

$0.480

$0.470

Problanco Electronics

Mexico . 5,857 parts In-Stock

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5,857

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Lixinc

USA . 3,112 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Kulean Microsystems

USA . 2,909 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,632 parts In-Stock

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2,632

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SupplyDigital Components

Austria . 2,456 parts In-Stock

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TANS Electronics

Latvia . 2,063 parts In-Stock

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2,063

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UHIMA Technologies

Türkiye . 854 parts In-Stock

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854

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Overview

Discover the NL17SG17DFT2G by Onsemi, a high-quality logic gate perfect for various applications. With a small outline and thin profile package design, this product offers ease of installation and operation. From military-grade temperature tolerance to quick propagation delay, this logic gate ensures top-notch performance. Trust in Onsemi's expertise in semiconductor manufacturing and upgrade your electronics with this reliable component. Experience seamless integration and improved functionality with the NL17SG17DFT2G - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and lightweight, ideal for portable devices or applications where weight is a concern.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

Propagation Delay (tpd): 58.1 ns

Low propagation delay ensures fast signal processing, making this logic gate suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh environments or applications where temperature can fluctuate.

Temperature Grade: MILITARY

Military-grade temperature rating indicates high reliability and durability, making this product suitable for rugged applications or military use.

Technical Specifications

Logic Gates NL17SG17DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SG

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

58.1 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NL17SG17DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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