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NL17SG125DFT2G

Onsemi

NL17SG125DFT2G by Onsemi

NL17SG125DFT2G by Onsemi is a 3-STATE bus driver with 4.8ns propagation delay, operating at -55 to 125 °C. It has a load capacitance of 30pF and supports supply voltages of 1.2/3.3V, making it ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

$0.770

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 5,900 parts In-Stock

1+ parts

$0.770

100+ parts

$0.172

1k+ parts

$0.100

10k+ parts

-

5,900

$0.770

$0.172

$0.100

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 2,940 parts In-Stock

1+ parts

$0.370

100+ parts

$0.138

1k+ parts

$0.079

10k+ parts

-

2,940

$0.370

$0.138

$0.079

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Digiode

USA . 2,216 parts In-Stock

1+ parts

$0.732

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2,216

$0.732

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Flip Electronics

USA . 114,000 parts In-Stock

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114,000

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NAC Semi

USA . 15,000 parts In-Stock

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$0.060

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$0.060

Vyrian

USA . 5,936 parts In-Stock

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5,936

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Distributors (Availability)

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Vigor

Singapore . 214 parts In-Stock

1+ parts

$0.090

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214

$0.090

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Corohmni

South Africa . 365 parts In-Stock

1+ parts

$0.335

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365

$0.335

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Microchip USA

USA . 5,776 parts In-Stock

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$0.528

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5,776

$0.528

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Corphita

USA . 154 parts In-Stock

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$0.693

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154

$0.693

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AZTECH Wire

Italy . 614 parts In-Stock

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$8.380

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614

$8.380

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Perfect Parts

USA . 87,185 parts In-Stock

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87,185

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Eastek

USA . 18,000 parts In-Stock

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$0.050

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18,000

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$0.050

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TANS Electronics

Latvia . 7,522 parts In-Stock

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7,522

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GreenTree Electronics

Israel . 5,900 parts In-Stock

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5,900

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Authorized Procurement Solutions

USA . 5,900 parts In-Stock

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5,900

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A-Z Elektronik GmbH

Germany . 5,259 parts In-Stock

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Problanco Electronics

Mexico . 4,671 parts In-Stock

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SupplyDigital Components

Austria . 3,949 parts In-Stock

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Kulean Microsystems

USA . 1,296 parts In-Stock

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UHIMA Technologies

Türkiye . 844 parts In-Stock

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Futuretech Components

Singapore . 552 parts In-Stock

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552

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Overview

Unlock the power of seamless data transmission with the NL17SG125DFT2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Bus Driver & Transceivers category. This product is ideal for a wide range of applications, offering fast propagation delay and low power consumption. Experience the value and benefits of this product with its compact design, true output polarity, and military-grade temperature grade. Trust Onsemi to provide innovative solutions that enhance your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications without adding unnecessary weight.

Propagation Delay At Nominal Supply: 4.8 ns

The low propagation delay ensures fast signal transmission, making the product suitable for high-speed communication applications.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving on circuit boards, making it convenient for compact designs.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes the product energy-efficient and compatible with common power supply configurations.

Load Capacitance (CL): 30 pF

The specified load capacitance ensures stable signal transmission, reducing the risk of signal distortion or interference.

Power Supplies (V): 1.2/3.3

Supporting multiple power supply voltages (1.2V and 3.3V) provides flexibility in system integration and compatibility with different power sources.

No. of Terminals: 5

The compact design with 5 terminals simplifies the connection process and reduces complexity in circuit layout.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design enhance the product's space efficiency, making it suitable for compact electronic devices.

Maximum I (ol): 8 Amp

The high maximum output current handling capacity of 8A allows for robust and reliable operation in demanding environments.

Propagation Delay (tpd): 19.6 ns

With a low propagation delay, the product ensures minimal signal delay, enabling efficient data transmission in time-critical applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance of 125 °C ensures reliable performance in harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signal, allowing for efficient signal routing and management.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures the product's functionality in extreme cold temperatures without compromising performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and conductivity, ensuring secure connections and reliable signal transmission.

Terminal Position: DUAL

The dual terminal position offers versatility in circuit connection options, allowing for flexibility in system design and integration.

No. of Ports: 2

Featuring 2 ports, the product supports bidirectional communication and versatile signal routing capabilities.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1mm, the product enables compact and low-profile designs for space-constrained applications.

Width: 1.25 mm

The narrow width of 1.25mm allows for efficient space utilization on circuit boards, enabling dense packing of components for optimal board layout.

Output Polarity: TRUE

The true output polarity ensures accurate signal representation and compatibility with standard logic levels, simplifying interfacing with other components.

Minimum Supply Voltage (Vsup): 0.9 V

The low minimum supply voltage requirement of 0.9V enables operation under low-power conditions, making the product energy-efficient.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering and assembly of the product during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260 °C allows for robust soldering and rework capabilities, ensuring product durability.

Length: 2 mm

The compact length of 2mm facilitates space-efficient placement on circuit boards, contributing to overall system miniaturization.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable performance in rugged environments and stringent operating conditions, making the product suitable for mission-critical applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, enhancing the product's versatility.

Terminal Form: GULL WING

The gull-wing terminal form factor offers mechanical stability and secure solder connections, ensuring durability and reliable signal transmission.

Packing Method: TR

The TR packing method (tape and reel) facilitates automated assembly processes and component handling, improving production efficiency and reducing manufacturing costs.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, the product allows for fine-pitch integration on circuit boards, enabling high-density mounting and compact designs.

Count Direction: UNIDIRECTIONAL

The unidirectional count direction simplifies signal routing and management, ensuring straightforward integration and operation within a system.

Control Type: ENABLE LOW

The enable low control type offers convenient signal control and management, allowing for seamless integration and operation in the system.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a maximum supply voltage of 3.6V provides a safety margin for voltage fluctuations and ensures stable operation under varying input conditions.

Maximum Power Supply Current (ICC): 20 mA

The product's maximum power supply current of 20mA indicates low power consumption, making it energy-efficient and suitable for battery-operated devices.

Technical Specifications

Bus Driver & Transceivers NL17SG125DFT2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

17SG

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

19.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

1.25 mm

Trade Compliance

NL17SG125DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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