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NL17SG07AMUTCG

Onsemi

NL17SG07AMUTCG by Onsemi

NL17SG07AMUTCG by Onsemi is a CMOS Logic Gate with 20ns Propagation Delay, 30pF Load Capacitance, and 3V Nominal Voltage. Ideal for military applications due to its MILITARY Temperature Grade and OPEN-DRAIN Output Characteristics. Package Style: SMALL OUTLINE, VERY THIN PROFILE.

Median Price

$0.145

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 195,000 parts In-Stock

1+ parts

-

100+ parts

$0.145

1k+ parts

$0.121

10k+ parts

$0.107

195,000

-

$0.145

$0.121

$0.107

DigiKey

USA . 195,000 parts In-Stock

1+ parts

-

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$0.180

195,000

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$0.180

Verical

USA . 195,000 parts In-Stock

1+ parts

-

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-

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10k+ parts

$0.134

195,000

-

-

-

$0.134

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 779 parts In-Stock

1+ parts

$0.113

100+ parts

-

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779

$0.113

-

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Vyrian

USA . 4,417 parts In-Stock

1+ parts

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4,417

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Distributors (Availability)

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Corphita

USA . 657 parts In-Stock

1+ parts

$0.107

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-

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657

$0.107

-

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Corohmni

South Africa . 268 parts In-Stock

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$0.119

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268

$0.119

-

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Component Stockers USA

USA . 161,790 parts In-Stock

1+ parts

$0.120

100+ parts

$0.120

1k+ parts

$0.110

10k+ parts

$0.110

161,790

$0.120

$0.120

$0.110

$0.110

AZTECH Wire

Italy . 305 parts In-Stock

1+ parts

$14.780

100+ parts

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305

$14.780

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TANS Electronics

Latvia . 8,018 parts In-Stock

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8,018

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SupplyDigital Components

Austria . 7,748 parts In-Stock

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7,748

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Problanco Electronics

Mexico . 6,559 parts In-Stock

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6,559

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Kulean Microsystems

USA . 1,832 parts In-Stock

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1,832

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UHIMA Technologies

Türkiye . 922 parts In-Stock

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922

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Microchip USA

USA . 482 parts In-Stock

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482

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Overview

Enhance your electronic projects with the NL17SG07AMUTCG by Onsemi, a top-quality logic gate that delivers speedy performance and reliable functionality. Manufactured by Onsemi, a trusted name in the industry, this product is perfect for a wide range of applications. With a low propagation delay, convenient surface mount design, and a small outline package, it offers unparalleled value to customers seeking efficiency and precision in their designs. Upgrade your projects today with the NL17SG07AMUTCG and experience the benefits of superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the logic gates.

Propagation Delay At Nominal Supply: 20 ns

The low propagation delay ensures fast processing and response times in electronic circuits.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 3

Compatible with standard voltage requirements in electronic devices.

Load Capacitance (CL): 30 pF

Optimized for efficient power consumption and performance.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, making it suitable for various applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Technical Specifications

Logic Gates NL17SG07AMUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVP

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

.3 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

20 ns

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NL17SG07AMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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