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NL17SG00AMUTCG

Onsemi

NL17SG00AMUTCG by Onsemi

NL17SG00AMUTCG by Onsemi is a CMOS Logic Gate with 2 inputs, 24.4 ns propagation delay, and operates b/w -55 to 125 °C. Ideal for military applications due to its small outline package style and dual terminal position.

Median Price

$0.145

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 192,000 parts In-Stock

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-

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$0.145

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$0.121

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$0.107

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$0.145

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$0.107

DigiKey

USA . 192,000 parts In-Stock

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$0.180

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$0.180

Verical

USA . 105,000 parts In-Stock

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$0.134

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Flip Electronics (Authorized)

USA . 2,601 parts In-Stock

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Digiode

USA . 1,283 parts In-Stock

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$0.113

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Chip Stock

USA . 52,000 parts In-Stock

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Vyrian

USA . 13,116 parts In-Stock

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USA . 2,601 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,728 parts In-Stock

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$0.107

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1,728

$0.107

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Corohmni

South Africa . 144 parts In-Stock

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$0.119

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144

$0.119

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$15.851

100+ parts

$14.424

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$12.998

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1,000

$15.851

$14.424

$12.998

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AZTECH Wire

Italy . 937 parts In-Stock

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$19.980

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$19.980

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Continental Prestige Electronics

USA . 192,000 parts In-Stock

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$0.143

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QUARKTWIN TECHNOLOGY LTD

USA . 17,281 parts In-Stock

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TANS Electronics

Latvia . 4,542 parts In-Stock

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SupplyDigital Components

Austria . 658 parts In-Stock

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UHIMA Technologies

Türkiye . 471 parts In-Stock

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Kulean Microsystems

USA . 272 parts In-Stock

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Microchip USA

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Problanco Electronics

Mexico . 9 parts In-Stock

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Overview

Experience superior performance and reliability with the NL17SG00AMUTCG logic gate by Onsemi. Known for their high-quality products, Onsemi delivers cutting-edge technology in a compact and durable package. Ideal for a wide range of applications, this logic gate offers customers seamless integration and efficiency. Elevate your projects with the value and benefits that Onsemi brings to the table, making complex tasks simple and achieving optimal results. Choose Onsemi for top-notch quality and unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the components within the logic gate, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable makes the logic gate easy to install on a circuit board, saving time and effort in the assembly process.

Nominal Supply Voltage / Vsup (V): 3

The logic gate operates at a nominal supply voltage of 3V, which is a common voltage used in many electronic systems, ensuring compatibility.

Propagation Delay (tpd): 24.4 ns

With a fast propagation delay of 24.4ns, this logic gate can process signals quickly and efficiently, making it suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

The logic gate can operate reliably at high temperatures up to 125 °C, making it suitable for use in a wide range of environments.

Technology: CMOS

Using CMOS technology, this logic gate offers low power consumption and high noise immunity, contributing to energy efficiency and reliable performance.

Technical Specifications

Logic Gates NL17SG00AMUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SG

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

24.4 ns

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NL17SG00AMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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