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NFAM2012L5B

Onsemi

NFAM2012L5B by Onsemi

NFAM2012L5B by Onsemi is a Motion Control IC with 39 terminals, operating voltage range of 13.5V to 16.5V, and temperature grade suitable for automotive applications. It features a rectangular package style made of plastic/epoxy material, with dimensions of 54.5mm x 33.5mm x 7.6mm (LxWxH). This AC motor controller has a max operating temperature of 125 °C and low supply current of 9mA, ideal for motion control systems in automotive environments.

Median Price

$32.950

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,091 parts In-Stock

1+ parts

-

100+ parts

$34.400

1k+ parts

-

10k+ parts

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1,091

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$34.400

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Flip Electronics (Authorized)

USA . 1,091 parts In-Stock

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1,091

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Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$31.500

1k+ parts

$28.190

10k+ parts

$26.530

4

-

$31.500

$28.190

$26.530

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 922 parts In-Stock

1+ parts

$49.875

100+ parts

-

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922

$49.875

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-

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Vyrian

USA . 1,365 parts In-Stock

1+ parts

$52.500

100+ parts

-

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1,365

$52.500

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Flip Electronics

USA . 1,091 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

-

1,091

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 267 parts In-Stock

1+ parts

$47.250

100+ parts

-

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267

$47.250

-

-

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Corohmni

South Africa . 69 parts In-Stock

1+ parts

$52.500

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-

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10k+ parts

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69

$52.500

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-

-

Problanco Electronics

Mexico . 8,036 parts In-Stock

1+ parts

-

100+ parts

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8,036

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TANS Electronics

Latvia . 7,860 parts In-Stock

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7,860

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SupplyDigital Components

Austria . 6,306 parts In-Stock

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6,306

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Kulean Microsystems

USA . 5,823 parts In-Stock

1+ parts

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5,823

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UHIMA Technologies

Türkiye . 800 parts In-Stock

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800

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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100

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Perfect Parts

USA . 84 parts In-Stock

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84

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GreenTree Electronics

Israel . 75 parts In-Stock

1+ parts

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75

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Overview

Experience seamless motion control like never before with the NFAM2012L5B by Onsemi. Crafted with precision and expertise, this cutting-edge product offers unparalleled quality and reliability in motion control ICs. From automotive applications to industrial automation, this versatile device is designed to meet your every need. Say goodbye to limitations and hello to endless possibilities with the NFAM2012L5B. Discover a world of convenience, efficiency, and innovation today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Nominal Supply Voltage (Vsup): 15 V

Optimal voltage for efficient performance and power consumption.

No. of Terminals: 39

Sufficient number of terminals for versatile connectivity options.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for demanding environments.

Minimum Operating Temperature: -40 °C

Can operate in low temperature conditions, enhancing its usability.

Technology: BIPOLAR

Bipolar technology offers precise control and accuracy in motion control applications.

Technical Specifications

Motion Control ICs NFAM2012L5B attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T39

Length:

54.5 mm

No. of Functions:

1

No. of Terminals:

39

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

DIP39(UNSPEC)

Package Shape:

Package Style (Meter):

IN-LINE, HEAT SINK/SLUG

Maximum Seated Height:

7.6 mm

Maximum Supply Current (Isup):

9 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

33.5 mm

Trade Compliance

NFAM2012L5B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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