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NFAM5065L4B

Onsemi

NFAM5065L4B by Onsemi

NFAM5065L4B by Onsemi is a Motion Control IC with 29 terminals, operating voltage range of 0-300V. It is a Brushless DC Motor Controller suitable for automotive applications, offering max output current of 100A and hybrid technology for efficient performance.

Median Price

$20.745

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1 parts In-Stock

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$19.300

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1

$19.300

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Rochester

USA . 108 parts In-Stock

1+ parts

$22.170

100+ parts

$20.840

1k+ parts

$18.850

10k+ parts

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108

$22.170

$20.840

$18.850

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Mouser Electronics

USA . 54 parts In-Stock

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$29.820

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54

$29.820

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DigiKey

USA . 37 parts In-Stock

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$30.150

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$19.006

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37

$30.150

$19.006

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Arrow

USA . 87 parts In-Stock

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$19.320

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87

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$19.320

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Verical

USA . 81 parts In-Stock

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$19.320

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81

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Flip Electronics (Authorized)

USA . 71 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 68 parts In-Stock

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$18.525

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$18.525

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Vyrian

USA . 6,455 parts In-Stock

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NAC Semi

USA . 180 parts In-Stock

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$30.120

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$27.800

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180

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$30.120

$27.800

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Flip Electronics

USA . 71 parts In-Stock

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71

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Distributors (Availability)

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Corphita

USA . 714 parts In-Stock

1+ parts

$17.550

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$17.550

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Corohmni

South Africa . 264 parts In-Stock

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$19.200

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264

$19.200

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Microchip USA

USA . 8,503 parts In-Stock

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$87.837

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$87.837

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Kulean Microsystems

USA . 7,582 parts In-Stock

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SupplyDigital Components

Austria . 7,256 parts In-Stock

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TANS Electronics

Latvia . 5,371 parts In-Stock

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Problanco Electronics

Mexico . 5,256 parts In-Stock

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UHIMA Technologies

Türkiye . 799 parts In-Stock

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799

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Perfect Parts

USA . 795 parts In-Stock

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795

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Overview

Experience unparalleled precision and reliability with the NFAM5065L4B by Onsemi, a leading manufacturer of Motion Control ICs. This cutting-edge product offers seamless integration into various applications, providing customers with unmatched performance and efficiency. With a wide range of features and benefits, including high-quality components and advanced technology, this product is guaranteed to exceed your expectations. Upgrade your system today and unlock the full potential of your projects with the NFAM5065L4B from Onsemi.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration and compact design, making it suitable for space-constrained applications.

Nominal Supply Voltage (Vsup): 300 V

High nominal supply voltage of 300V provides compatibility with a wide range of power sources, making it versatile for different applications.

No. of Terminals: 29

Having 29 terminals allows for more connection options and flexibility in the system design.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125 °C ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C enables operation in cold conditions without compromising performance.

Maximum Seated Height: 7.7 mm

Low maximum seated height of 7.7mm allows for a slim and compact design, suitable for applications with space constraints.

Width (mm): 31 mm

Narrow width of 31mm enables easy integration into tight spaces and compact systems.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

Being a brushless DC motor controller, this IC offers efficient and precise control for brushless motors, making it suitable for applications requiring high performance.

Minimum Supply Voltage (Vsup): 0 V

Low minimum supply voltage of 0V allows for flexibility in power source selection and operation in low-power applications.

Length: 54.5 mm

Moderate length of 54.5mm provides a balanced form factor for ease of integration in various systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets the stringent requirements and reliability standards of the automotive industry.

Maximum Supply Current (Isup): 6 mA

Low maximum supply current of 6mA helps in minimizing power consumption and heat dissipation, improving overall efficiency.

Maximum Output Current: 100 A

High maximum output current of 100A allows for driving high-power motors or loads, making it suitable for demanding applications.

Technology: HYBRID

Utilizing hybrid technology offers a balance between performance and efficiency, making this IC ideal for a wide range of applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and reliable connections, making it suitable for applications with mechanical stress or vibration.

Maximum Supply Voltage (Vsup): 400 V

High maximum supply voltage of 400V allows for compatibility with a wide range of power sources and operation in high-voltage applications.

Technical Specifications

Motion Control ICs NFAM5065L4B attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-XDMA-T29

Length:

54.5 mm

No. of Functions:

1

No. of Terminals:

29

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

100 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Equivalence Code:

MODULE,29LEAD,1.4

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

7.7 mm

Maximum Supply Current (Isup):

6 mA

Maximum Supply Voltage (Vsup):

400 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

300 V

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

31 mm

Trade Compliance

NFAM5065L4B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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