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NFAM0512L5B

Onsemi

NFAM0512L5B by Onsemi

NFAM0512L5B by Onsemi is a Motion Control IC with 39 terminals, operating b/w -40 to 125 °C. It features a max output current of 10 A and supports BRUSHLESS DC MOTOR CONTROL applications. The IC has a package style of MICROELECTRONIC ASSEMBLY and uses HYBRID technology for automotive-grade temperature environments.

Median Price

$21.802

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19,525 parts In-Stock

1+ parts

-

100+ parts

$19.380

1k+ parts

$17.340

10k+ parts

$16.320

19,525

-

$19.380

$17.340

$16.320

Verical

USA . 19,365 parts In-Stock

1+ parts

-

100+ parts

$24.225

1k+ parts

$21.675

10k+ parts

$20.400

19,365

-

$24.225

$21.675

$20.400

Flip Electronics (Authorized)

USA . 69 parts In-Stock

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69

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Vyrian

USA . 13,382 parts In-Stock

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13,382

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Digiode

USA . 1,052 parts In-Stock

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1,052

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Flip Electronics

USA . 69 parts In-Stock

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69

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Distributors (Availability)

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AZTECH Wire

Italy . 45 parts In-Stock

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$9.200

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45

$9.200

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Problanco Electronics

Mexico . 8,384 parts In-Stock

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SupplyDigital Components

Austria . 6,674 parts In-Stock

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TANS Electronics

Latvia . 3,046 parts In-Stock

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Kulean Microsystems

USA . 2,932 parts In-Stock

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Corphita

USA . 2,461 parts In-Stock

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UHIMA Technologies

Türkiye . 837 parts In-Stock

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837

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Perfect Parts

USA . 619 parts In-Stock

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619

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Corohmni

South Africa . 323 parts In-Stock

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323

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Authorized Procurement Solutions

USA . 200 parts In-Stock

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GreenTree Electronics

Israel . 116 parts In-Stock

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Overview

Experience seamless motion control with the NFAM0512L5B by Onsemi. Crafted with precision and expertise, this product offers unparalleled quality and reliability in the realm of Motion Control ICs. Perfect for automotive applications, this Brushless DC Motor Controller ensures smooth operation and optimal performance. Unlock a world of possibilities with the NFAM0512L5B, where innovation meets excellence to deliver superior value and functionality to our customers. Elevate your projects with Onsemi's cutting-edge technology and experience the difference today.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for efficient and compact PCB design, saving space in applications where size is a concern.

Nominal Supply Voltage (Vsup): 15 V

Optimal supply voltage ensures stable and reliable performance of the motion control IC.

No. of Terminals: 39

Sufficient number of terminals for versatile connectivity options and integration with external components.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly offers high precision and reliability, crucial for motion control applications where accuracy is key.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the IC can withstand demanding environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the IC to operate in a variety of temperature environments, making it versatile for different applications.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in wiring configurations, enhancing reliability and ease of use.

Maximum Seated Height: 7.7 mm

Low seated height facilitates compact design and integration of the IC into space-constrained applications.

Width (mm): 31 mm

Moderate width enables easy placement and mounting of the IC on PCBs, enhancing installation convenience.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

Specifically designed for brushless DC motor control, providing specialized functionality and performance for motor control applications.

Minimum Supply Voltage (Vsup): 13.5 V

Wide range of supply voltage allows flexibility in power source selection and compatibility with various systems.

Length: 54.5 mm

Optimal length for accommodating necessary circuitry and components, balancing size and functionality.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliability in harsh automotive environments, making it suitable for automotive applications.

Maximum Supply Current (Isup): 9 mA

Low supply current consumption for efficient power usage and minimal energy wastage.

Maximum Output Current: 10 A

High output current capability for driving motors and other high-current devices, providing sufficient power for most applications.

Technology: HYBRID

Hybrid technology combines the advantages of different technologies to deliver optimal performance, efficiency, and reliability in motion control applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form offers robust mechanical connection and secure mounting, ensuring stability and durability in operation.

Maximum Supply Voltage (Vsup): 16.5 V

High maximum supply voltage accommodates various power sources and ensures compatibility with higher voltage systems.

Technical Specifications

Motion Control ICs NFAM0512L5B attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO REQUIRE SUPPLY UP TO 800V FOR IGBT DRIVING

JESD-30 Code:

R-XDMA-T39

Length:

54.5 mm

No. of Functions:

1

No. of Terminals:

39

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

10 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

7.7 mm

Maximum Supply Current (Isup):

9 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

31 mm

Trade Compliance

NFAM0512L5B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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