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NFAM3065L4BT

Onsemi

NFAM3065L4BT by Onsemi

NFAM3065L4BT by Onsemi is a Motion Control IC with 30 terminals, operating voltage range of 0-300V. It features a max output current of 60A and operates in automotive applications. With hybrid technology and through-hole terminal form, it offers precise control for brushless DC motors.

Median Price

$19.230

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 93 parts In-Stock

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$22.260

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93

$22.260

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DigiKey

USA . 48 parts In-Stock

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$22.260

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$12.954

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48

$22.260

$12.954

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Flip Electronics (Authorized)

USA . 206 parts In-Stock

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Rochester

USA . 93 parts In-Stock

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$12.960

1k+ parts

$11.590

10k+ parts

$10.910

93

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$12.960

$11.590

$10.910

Verical

USA . 93 parts In-Stock

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-

100+ parts

$16.200

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$14.488

10k+ parts

$13.637

93

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$16.200

$14.488

$13.637

Distributors (In-Stock)

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Digiode

USA . 847 parts In-Stock

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$16.625

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847

$16.625

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Vyrian

USA . 5,930 parts In-Stock

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Flip Electronics

USA . 206 parts In-Stock

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Microchip USA

USA . 1,016 parts In-Stock

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$0.427

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1,016

$0.427

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Corphita

USA . 2,376 parts In-Stock

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$15.750

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2,376

$15.750

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Corohmni

South Africa . 231 parts In-Stock

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$17.500

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QUARKTWIN TECHNOLOGY LTD

USA . 14,917 parts In-Stock

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TANS Electronics

Latvia . 7,785 parts In-Stock

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SupplyDigital Components

Austria . 7,297 parts In-Stock

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Kulean Microsystems

USA . 5,681 parts In-Stock

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Problanco Electronics

Mexico . 3,015 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 327 parts In-Stock

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Perfect Parts

USA . 207 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the NFAM3065L4BT motion control IC by Onsemi. Crafted with precision by a trusted manufacturer, this product offers seamless integration and superior functionality in various applications. From automotive systems to industrial automation, the NFAM3065L4BT delivers exceptional value with its advanced technology and robust design. Trust in Onsemi to provide you with the quality and innovation you need for your next project.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into electronic systems and provides efficient use of space.

Nominal Supply Voltage: 300 V

High nominal supply voltage allows for compatibility with a wide range of applications and power requirements.

No. of Terminals: 30

Having a high number of terminals enables versatile connectivity options and functionality.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation in extreme cold conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides a durable and corrosion-resistant surface for reliable terminal connections.

Maximum Output Current: 60 A

High maximum output current capability enables the control of powerful motors and devices.

Technology: HYBRID

Hybrid technology offers a balance between efficiency, performance, and cost-effectiveness in motion control applications.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability and durability in automotive applications with varying temperature and humidity levels.

Maximum Supply Voltage: 400 V

High maximum supply voltage allows for flexibility in power input options and compatibility with high voltage systems.

Technical Specifications

Motion Control ICs NFAM3065L4BT attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO REQUIRE 13V TO 18.5V SUPPLY

JESD-30 Code:

R-XDMA-T30

JESD-609 Code:

e3

Length:

54.5 mm

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

60 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Equivalence Code:

MODULE,30LEAD,1.4

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

13.2 mm

Maximum Supply Current (Isup):

6 mA

Maximum Supply Voltage (Vsup):

400 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

300 V

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

31 mm

Trade Compliance

NFAM3065L4BT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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