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LM629M-6

Texas Instruments

LM629M-6 by Texas Instruments

Texas Instruments' LM629M-6 is a Motion Control IC with 24 terminals, operating at 5V. Ideal for BRUSH DC MOTOR CONTROL applications, it has a temperature range of -40 to 85°C and supports surface mount installation.

Median Price

$45.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 2 parts In-Stock

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$45.000

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Vyrian

USA . 6,811 parts In-Stock

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Digiode

USA . 2,942 parts In-Stock

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Anansix

USA . 609 parts In-Stock

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Chip Stock

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496

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 605 parts In-Stock

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$1.500

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605

$1.500

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One Stop Electronics

USA . 352 parts In-Stock

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$6.500

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Corohmni

South Africa . 99 parts In-Stock

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$12.488

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AZTECH Wire

Italy . 238 parts In-Stock

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$13.362

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Parana Technologies

USA . 1,798 parts In-Stock

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$21.272

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$21.581

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DigiPath Technology Company

USA . 1,211 parts In-Stock

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$23.423

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$21.549

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ChromeModa Solutions

Germany . 1,835 parts In-Stock

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$23.901

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$19.599

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IDEA Electronic Components Group

UK . 713 parts In-Stock

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$23.901

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$22.706

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$21.511

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713

$23.901

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$21.511

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Continental Prestige Electronics

USA . 4,736 parts In-Stock

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Argo Parts USA

USA . 4,482 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 2,177 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Kepictronics

USA . 101 parts In-Stock

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Overview

Elevate your motion control projects with the LM629M-6 by Texas Instruments. Crafted with precision and expertise, this motion control IC offers unparalleled performance and reliability for a wide range of applications. From robotics to industrial automation, this product delivers seamless operation and precise control. Experience the value of Texas Instruments quality with the LM629M-6, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Ensures durability and protection for the internal components, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 5 V

Compatible with standard power supply requirements, making integration into existing systems seamless.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in a wide range of industrial environments without the risk of overheating.

Technology: NMOS

Utilizing NMOS technology offers high performance and efficiency for motion control applications.

Technical Specifications

Motion Control ICs LM629M-6 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

100 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

NMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

LM629M-6 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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