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LM629MX-8

Texas Instruments

LM629MX-8 by Texas Instruments

LM629MX-8 by Texas Instruments is a Motion Control IC with 24 terminals, operating at 5V. It features a small outline package style and supports brush DC motor control applications. With a temperature range of -40 to 85°C, it is ideal for industrial use.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Digiode

USA . 4,466 parts In-Stock

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Vyrian

USA . 485 parts In-Stock

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485

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Anansix

USA . 134 parts In-Stock

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NAC Semi

USA . 81 parts In-Stock

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One Stop Electronics

USA . 1,164 parts In-Stock

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$4.500

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$4.500

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Ampacity Inc.

Singapore . 811 parts In-Stock

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$5.500

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811

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Parana Technologies

USA . 439 parts In-Stock

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$11.306

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$11.739

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AZTECH Wire

Italy . 216 parts In-Stock

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$12.003

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Corohmni

South Africa . 44 parts In-Stock

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$12.304

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DigiPath Technology Company

USA . 186 parts In-Stock

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$12.449

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$11.453

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ChromeModa Solutions

Germany . 5,168 parts In-Stock

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$12.703

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$10.416

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IDEA Electronic Components Group

UK . 1,703 parts In-Stock

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$11.433

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Corphita

USA . 3,085 parts In-Stock

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Argo Parts USA

USA . 2,672 parts In-Stock

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Microchip USA

USA . 303 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Continental Prestige Electronics

USA . 24 parts In-Stock

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Overview

Elevate your motion control applications with the LM629MX-8 by Texas Instruments. Crafted with precision and expertise, this top-of-the-line motion control IC offers unparalleled quality and reliability. Designed for industrial-grade performance, this compact controller boasts a wide range of applications in brush DC motor control. With a nominal supply voltage of 5V and maximum operating temperature of 85°C, the LM629MX-8 delivers exceptional value and benefits to customers seeking seamless motion control solutions. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product, making it a good choice for long-term use.

Surface Mount: YES

The ability to be surface-mounted allows for easy and efficient installation, making this product convenient for assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape helps in optimizing space utilization and allows for easy integration into compact systems.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage ensures compatibility with a wide range of systems and applications, making this product versatile and flexible.

Power Supplies (V): 5

Having 5 power supplies enhances the performance and efficiency of the product, making it a reliable choice for demanding applications.

No. of Terminals: 24

The 24 terminals provide ample connectivity options, enabling seamless integration with other components and systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and improves overall system layout, making this product ideal for compact designs.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliable performance in various environmental conditions, enhancing the product's durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this product suitable for use in both hot and cold environments, increasing its versatility.

Terminal Finish: TIN LEAD

The use of tin-lead terminal finish enhances conductivity and solderability, ensuring robust connections and reliable operation.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and connectivity options, making this product adaptable to different setups.

Maximum Seated Height: 2.65 mm

The low maximum seated height allows for compact and space-efficient designs, making this product suitable for applications with size constraints.

Technical Specifications

Motion Control ICs LM629MX-8 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

110 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

NMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

LM629MX-8 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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